Surface-Treated Metal Material, Metal Foil With Carrier, Connector, Terminal, Laminate, Shielding Tape, Shielding Material, Printed Wiring Board, Processed Metal Member, Electronic Device, And Method For Manufacturing Printed Wiring Board

Patent metadata

Field	Value
Publication number	US-2016212836-A1
Application number	US-201414915293-A
Country	US
Kind code	A1
Filing date	Aug 29, 2014
Priority date	Aug 29, 2013
Publication date	Jul 21, 2016
Grant date	—

Abstract

A surface-treated metal material good in heat absorbency and heat releasability is provided. The surface-treated metal material has a heat conductivity of 32 W/(m·K) or higher; and a color difference ΔL based on JIS Z8730 of the surface thereof satisfying ΔL≦−40.

First claim

1 . A surface-treated metal material having:
a heat conductivity of 32 W/(m·K) or higher; and a color difference ΔL based on JIS Z8730 of a surface thereof satisfying ΔL≦−40.

2 . The surface-treated metal material according to claim 1 , wherein with respect to color differences ΔL, Δa based on JIS Z8730 of a surface thereof,
when Δa≦0.23, ΔL satisfies ΔL≦−40;
when 0.23<Δa≦2.8, ΔL satisfies ΔL≦−8.5603×Δa−38.0311; and
when 2.8<Δa, ΔL satisfies ΔL≦−62.

3 . The surface-treated metal material according to claim 1 , wherein with respect to color differences ΔL, Δb based on JIS Z8730 of a surface thereof,
when Δb≦−0.68, ΔL satisfies ΔL≦−40;
when −0.68<Δb≦0.83, ΔL satisfies ΔL≦−2.6490×Δb−41.8013;
when 0.83<Δb≦1.2, ΔL satisfies ΔL≦−48.6486×Δb−3.6216; and
when 1.2<Δb, ΔL satisfies ΔL≦−62.

4 . The surface-treated metal material according to claim 1 , wherein with respect to color differences ΔL, Δa based on JIS Z8730 of a surface thereof,
when Δa≦0.23, ΔL satisfies ΔL≦−40;
when 0.23<Δa≦2.8, ΔL satisfies ΔL≦−8.5603×Δa−38.0311; and
when 2.8<Δa, ΔL satisfies ΔL≦−62, and
with respect to color differences ΔL, Δb based on JIS Z8730 of the surface thereof,
when Δb≦−0.68, ΔL satisfies ΔL≦−40;
when −0.68<Δb≦0.83, ΔL satisfies ΔL≦−2.6490×Δb−41.8013;
when 0.83<Δb≦1.2, ΔL satisfies ΔL≦−48.6486×Δb−3.6216; and
when 1.2<Δb, ΔL satisfies ΔL≦−62.

5 . The surface-treated metal material according to claim 1 , wherein the color difference ΔL satisfies ΔL≦−45.

6 . The surface-treated metal material according to claim 5 , wherein the color difference ΔL satisfies ΔL≦−55.

7 . The surface-treated metal material according to claim 6 , wherein the color difference ΔL satisfies ΔL≦−60.

8 . The surface-treated metal material according to claim 7 , wherein the color difference ΔL satisfies ΔL≦−65.

9 . The surface-treated metal material according to claim 8 , wherein the color difference ΔL satisfies ΔL≦−68.

10 . The surface-treated metal material according to claim 9 , wherein the color difference ΔL satisfies ΔL≦−70.

11 . The surface-treated metal material according to claim 1 , satisfying at least one of the following (A) to (C);
(A) the metal material is a metal material for heat release, (B) the metal material has a treated surface layer comprising a metal, (C) the metal material has a treated surface layer comprising a roughening-treated layer.

12 . (canceled)

13 . (canceled)

14 . The surface-treated metal material according to claim 1 , having a 60° glossiness of 10 to 80%.

15 . The surface-treated metal material according to claim 1 , having a 60° glossiness of lower than 10%.

16 . The surface-treated metal material according to claim 1 , having a treated surface layer comprising a chromium layer or a chromate layer and/or a silane-treated layer.

17 . The surface-treated metal material according to claim 1 , wherein the metal material is formed of copper, a copper alloy, aluminum, an aluminum alloy, iron, an iron alloy, nickel, a nickel alloy, gold, a gold alloy, silver, a silver alloy, a platinum-group metal, a platinum-group metal alloy, chromium, a chromium alloy, magnesium, a magnesium alloy, tungsten, a tungsten alloy, molybdenum, a molybdenum alloy, lead, a lead alloy, tantalum, a tantalum alloy, tin, a tin alloy, indium, an indium alloy, zinc, or a zinc alloy.

18 . (canceled)

19 . The surface-treated metal material according to claim 17 , wherein the metal material is formed of a phosphor bronze, a Corson alloy, a red brass, a brass, a German silver, or another copper alloy.

20 . (canceled)

21 . The surface-treated metal material according to claim 1 , wherein the treated surface layer has a resin layer or a resin layer comprising a dielectric on a surface thereof.

22 . (canceled)

23 . A metal foil with a carrier, having a middle layer and an ultrathin metal layer in this order on one surface or both surfaces of the carrier, wherein the ultrathin metal layer is the surface-treated metal material according to claim 1 .

24 . (canceled)

25 . (canceled)

26 . A connector or a terminal comprising the surface-treated metal material according to claim 1 .

27 . (canceled)

28 . A laminate manufactured by laminating the surface-treated metal material according to claim 1 or a metal foil with a carrier, having a middle layer and an ultrathin metal layer in this order on one surface or both surfaces of the carrier, wherein the ultrathin metal layer is the surface-treated metal material according to claim 1 with a resin substrate.

29 . A shielding tape or a shielding material or a printed wiring board comprising the laminate according to claim 28 .

30 . (canceled)

31 . A processed metal member comprising the surface-treated metal material according to claim 1 or a metal foil with a carrier, having a middle layer and an ultrathin metal layer in this order on one surface or both surfaces of the carrier, wherein the ultrathin metal layer is the surface-treated metal material according to claim 1 .

32 . An electronic device comprising the surface-treated metal material according to claim 1 or a metal foil with a carrier, having a middle layer and an ultrathin metal layer in this order on one surface or both surfaces of the carrier, wherein the ultrathin metal layer is the surface-treated metal material according to claim 1 .

33 . A method for manufacturing a printed wiring board, comprising the steps of:
providing a metal foil with a carrier, having a middle layer and an ultrathin metal layer in this order on one surface or both surfaces of the carrier, wherein the ultrathin metal layer is the surface-treated metal material according to claim 1 , and an insulating substrate; laminating the metal foil with a carrier and the insulating substrate; after the metal foil with a carrier and the insulating substrate are laminated, peeling off the carrier of the metal foil with a carrier to thereby form a metal clad laminated plate; and thereafter forming a circuit by any one method of a semi-additive method, a subtractive method, a partly additive method and a modified semi-additive method.

34 . A method for manufacturing a printed wiring board, comprising the steps of:
forming a circuit on a surface of the ultrathin metal layer side of a metal foil with a carrier, having a middle layer and an ultrathin metal layer in this order on one surface or both surfaces of the carrier, wherein the ultrathin metal layer is the surface-treated metal material according to claim 1 or a surface of the carrier side thereof; forming a resin layer on the surface of the ultrathin metal layer side of the metal foil with a carrier or the surface of the carrier side thereof so as to embed the circuit; forming a circuit on the resin layer; after the circuit is formed on the resin layer, peeling off the carrier or the ultrathin metal layer; and after the carrier or the ultrathin metal layer is peeled off, removing the ultrathin metal layer or the carrier to thereby expose the circuit formed on the surface of the ultrathin metal layer side or the surface of the carrier side and embedded in the resin layer.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Arai Hideta
• Fukuchi Ryo
• Morioka Satoru
• Era Naohiko

Classifications

• H05K3/389

  by the use of a coupling agent, e.g. silane · CPC title

• H05K3/025

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title

• C22C9/01

  with aluminium as the next major constituent · CPC title

• C22C18/00

  Alloys based on zinc · CPC title

• H05K7/20436

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title