Production method of metallized substrate

Patent metadata

Field	Value
Publication number	US-9374893-B2
Application number	US-201113581665-A
Country	US
Kind code	B2
Filing date	Feb 28, 2011
Priority date	Mar 2, 2010
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A production method for a metallized substrate to produce a metallized substrate which comprises: a sintered nitride ceramic substrate; a titanium nitride layer formed on the sintered substrate; and a metal layer containing copper, silver and titanium formed on the titanium nitride layer. The method comprises: a step of layering a first paste layer containing copper powder and titanium hydride powder on the sintered nitride ceramic substrate, to produce a first layered body; a step of layering a second paste layer containing silver-copper alloy powder on the first paste layer of the first layered body, to produce a second layered body; and a step of firing the second layered body, to thereby form the titanium nitride layer and the metal layer on the sintered nitride ceramic substrate.

First claim

The invention claimed is:

1. A production method of a metallized substrate comprising a wiring pattern, the metallized substrate comprising: a sintered nitride ceramic substrate; a titanium nitride layer formed on the sintered substrate; and a metal layer being the wiring pattern and containing copper, silver and titanium formed on the titanium nitride layer, the method comprising:
a step of layering a first paste layer by means of a first paste composition containing copper powder and titanium hydride powder and having a thixotropic index of 0.2 to 1.0 on a part of the sintered nitride ceramic substrate, to produce a first layered body, wherein the part of the sintered nitride ceramic substrate is a part where the wiring pattern is to be formed, and wherein the copper powder is a mixed powder of copper powder A having an average particle size of 0.1 μm or more and less than 1.0 μm and copper powder B having an average particle size of 1.0 to 5.0 μm;
a step of layering a second paste layer by means of a second paste composition containing silver-copper alloy powder and not containing a titanium component on the first paste layer of the first layered body, to produce a second layered body, wherein the silver-copper alloy powder has a melting point of 630 to 850° C. and an average particle size of 0.1 to 20 μm; and
a step of firing the second layered body, at a temperature such that the second paste composition melts wherein the temperature is not greater than melting point of copper and wherein the firing is carried out under a condition such that a shape of the first paste layer is maintained, to thereby form the titanium nitride layer and the metal layer on the sintered nitride ceramic substrate.

2. The production method of a metallized substrate according to claim 1 , wherein the first paste layer further contains silver powder and/or silver-copper alloy powder, and contains the silver powder and/or the silver-copper alloy powder in an amount of 1 part by mass or more and 80 parts by mass or less, with respect to 100 parts by mass of the copper powder.

3. The production method of a metallized substrate according to claim 1 , wherein the second paste layer further contains copper powder, and contains the copper powder in an amount of 1 part by mass or more and 300 parts by mass or less, with respect to 100 parts by mass of the silver-copper alloy powder.

4. The production method of a metallized substrate according to claim 1 , wherein the content of the titanium hydride powder in the first paste layer is 1 part by mass or more and 10 parts by mass or less, based on the total mass of the copper component and the silver component in the first paste layer and the second paste layer together as 100 parts by mass.

5. The production method of a metallized substrate according claim 1 , wherein the mass ratio (silver component/copper component) of the silver component to the copper component in terms of the silver component and the copper component in the first paste layer and the second paste layer together is 0.15 or more and 0.8 or less.

6. The production method of a metallized substrate according to claim 1 , wherein the step of firing the layered body is a step of firing the layered body in a heat-resistant container under a non-oxidizing atmosphere.

7. The production method of a metallized substrate according to claim 1 , wherein the silver-copper alloy powder in the second paste layer contains copper in an amount of 20 to 35 mass %.

8. The production method of a metallized substrate according to claim 1 , wherein the silver-copper alloy powder in the second paste layer has a eutectic composition of silver-copper.

9. The production method of a metallized substrate according to claim 1 ,
wherein the first paste layer is formed by printing the first paste composition;
the first paste composition comprises: 100 parts by mass of the copper powder; 1 to 10 parts by mass of the titanium hydride powder having an average particle size of 0.1 to 20 μm; and 1 to 10 parts by mass of a binder resin; and
the copper powder in the first paste composition is the mixed powder containing the copper powder A in an amount of 30 parts by mass or more and less than 100 parts by mass, and the copper powder B as a remainder.

10. The production method of a metallized substrate according to claim 9 , wherein the first paste composition comprises, as the binder resin:
0.2 to 3.0 parts by mass of an ethylcellulose resin; and
0.5 to 8.0 parts by mass of an acrylic resin.

11. A production method of a metallized substrate comprising a wiring pattern, the metallized substrate comprising: a sintered nitride ceramic substrate; a titanium nitride layer formed on the sintered substrate; and a metal layer being the wiring pattern and containing copper, silver, and titanium formed on the titanium nitride layer, the method comprising:
a step of layering a first paste layer by means of a first paste composition containing copper powder and titanium hydride powder and having a thixotropic index of 0.2 to 1.0 on a part of the sintered nitride ceramic substrate, to produce a first layered body, wherein the part of the sintered nitride ceramic substrate is a part where the wiring pattern is to be formed, and wherein the copper powder is a mixed powder of copper powder A having an average particle size of 0.1 μm or more and less than 1.0 μm and copper powder B having an average particle size of 1.0 to 5.0 μm;
a step of layering a second paste layer by means of a second paste composition containing silver-copper alloy powder and not containing a titanium component on the first paste layer of the first layered body, to produce a layered body, wherein the silver-copper alloy powder has a melting point of 630 to 850° C. and an average particle size of 0.1 to 20 μm;
a step of layering a third paste layer containing copper powder between the first paste layer and the second paste layer, or on the second paste layer, to produce a layered body; and
a step of firing the layered body obtained through these steps, at a temperature such that the second paste composition melts wherein the temperature is not greater than melting point of copper and wherein the firing is carried out under a condition such that a shape of the first paste layer is maintained, to thereby form the titanium nitride layer and the metal layer on the sintered nitride ceramic substrate.

12. The production method of a metallized substrate according to claim 11 , wherein the content of the titanium hydride powder in the first paste layer is 1 part by mass or more and 10 parts by mass or less, based on the total mass of the copper component and the silver component in the first paste layer, the second paste layer, and the third paste layer altogether as 100 parts by mass.

13. The production method of a metallized substrate according to claim 11 , wherein the step of firing the layered body is a step of firing the layered body in a container under a non-oxidizing atmosphere.

14. The production method of a metallized substrate according to claim 11 , wherein the third paste layer does not contain a titanium component.

15. The production method of a metallized substrate according to claim 11 , wherein the silver-copper alloy powder in the second paste layer contains copper in an amount of 20 to 35 mass %.

16. The production method of a metallized substrate according to claim 11 , wherein the silver-copper alloy powder in the second paste layer has a eutectic composition of silver-copper.

17. The production method of a metallized substrate according to claim 11 ,
wherei

Assignees

• Takahashi Naoto
• Tokuyama Corp

Inventors

• Takahashi Naoto

Classifications

• H05K3/388

  by the use of a metallic or inorganic thin film adhesion layer · CPC title

• H05K2203/1476

  Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning · CPC title

• H05K1/092 Primary

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H05K2203/1131

  Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title