Composite laminate and electronic device

Patent metadata

Field	Value
Publication number	US-2016152004-A1
Application number	US-201414766875-A
Country	US
Kind code	A1
Filing date	Apr 28, 2014
Priority date	Apr 26, 2013
Publication date	Jun 2, 2016
Grant date	—

Abstract

Problem: To provide a metal plate, a composite laminate and the like, each of which has excellent long-term reliability.
Resolution means: A composite laminate ( 12 ) includes a first metal layer ( 1 ), a second metal layer ( 2 ), a third metal layer ( 3 ), and a fourth layer ( 4 ). The first metal layer ( 1 ) contains copper. The second metal layer ( 2 ) is arranged on the lower surface of the first metal layer ( 1 ). The third metal layer ( 3 ) is arranged on the lower surface of the second metal layer ( 2 ), and contains silver, at least one metal selected from a first group made up of Sn, Al, and Ga, and at least one metal selected from a second group made up of In and Sb. The fourth layer ( 4 ) is arranged on the lower surface of the third metal layer ( 3 ). The third metal layer ( 3 ) has a metal portion ( 2 A) that partially penetrates the second metal layer ( 2 ) from the third metal layer ( 3 ).

First claim

1 . A composite laminate, comprising:
a first metal layer containing copper; a second metal layer arranged on a lower surface of the first metal layer; a third metal layer that is arranged on a lower surface of the second metal layer, and contains silver, at least one metal selected from a first group made up of Sn, Al, and Ga, and at least one metal selected from a second group made up of In and Sb; and a fourth layer arranged on a lower surface of the third metal layer; wherein the third metal layer contains a metal portion that partially penetrates the second metal layer.

2 . The composite laminate according to claim 1 , wherein the third metal layer further contains at least one item selected from among Ti, Hf, and Zr.

3 . The composite laminate according to claim 1 , wherein the metal portion contains an Ag—In alloy.

4 . The composite laminate according to claim 1 , wherein
the fourth layer is a metal layer with a lower coefficient of thermal expansion than that of the first metal layer.

5 . The composite laminate according to claim 4 , wherein the fourth layer contains Mo as a primary component.

6 . The composite laminate according to claim 4 , further comprising a fifth layer that is a ceramic substrate, wherein the fourth layer is jointed to the fifth layer.

7 . The composite laminate according to claim 1 , wherein
the fourth layer is a ceramic substrate.

8 . An electronic device, comprising:
the composite laminate described in claim 6 ; and an electronic component mounted to the composite laminate.

9 . A composite laminate, comprising:
a first metal layer containing copper; a second metal layer arranged on a lower surface of the first metal layer; a third layer that is arranged on a lower surface of the second metal layer, a metal portion that partially penetrates the second metal layer from the third layer side; and the metal portion containing silver, at least one metal selected from a first group made up of Sn, Al, and Ga, and at least one metal selected from a second group made up of In and Sb.

10 . The composite laminate according to claim 9 , wherein
the third layer is a metal layer with a lower coefficient of thermal expansion than that of the first metal layer.

11 . The composite laminate according to claim 10 , wherein
the third layer is jointed to a ceramic substrate.

12 . The composite laminate according to claim 9 , wherein
the third layer is a ceramic substrate.

13 . An electronic device, comprising:
the composite laminate described in claim 11 ; and an electronic component mounted to the composite laminate.

Assignees

• Kyocera Corp

Inventors

• Niino Noritaka

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W70/692

  Ceramics or glasses · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title