Apparatus and methods related to conformal coating implemented with surface mount devices
US-10524350-B2 · Dec 31, 2019 · US
Removal of non-metallic coatings, e.g. for repairing
Removal of non-metallic coatings, e.g. for repairing · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/288 |
| Official title | {Removal of non-metallic coatings, e.g. for repairing} |
| Display label | Removal of non-metallic coatings, e.g. for repairing |
| Total patents | 115 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 13 |
| 2017 | 15 |
| 2018 | 11 |
| 2019 | 14 |
| 2020 | 16 |
| 2021 | 9 |
| 2022 | 9 |
| 2023 | 6 |
| 2024 | 7 |
| 2025 | 6 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of forming a passivation layer on a substrate
US-2019338414-A1 · Nov 7, 2019 · US
Maintenance fixture for printed circuit board assembly
US-10455751-B2 · Oct 22, 2019 · US
Electronic device module and method of manufacturing the same
US-2019310687-A1 · Oct 10, 2019 · US
Method of making a rigid-flex circuit board
US-10412827-B1 · Sep 10, 2019 · US
Electronic device and method for producing same
US-10375867-B2 · Aug 6, 2019 · US
Surface mounted contact fingers
US-2019215970-A1 · Jul 11, 2019 · US
Display module and method for coating the same
US-2019200422-A1 · Jun 27, 2019 · US
Laser ablation for wire bonding on organic solderability preservative surface
US-2019198475-A1 · Jun 27, 2019 · US
Printed circuit board assembly
US-2019174628-A1 · Jun 6, 2019 · US
Biodegradable materials for multilayer transient printed circuit boards
US-10292263-B2 · May 14, 2019 · US
Conformal coating materials
US-10257940-B2 · Apr 9, 2019 · US
Display module and method for coating the same
US-10251224-B2 · Apr 2, 2019 · US
Materials, electronic systems and modes for active and passive transience
US-10154592-B2 · Dec 11, 2018 · US
Component embedded package carrier and manufacturing method thereof
US-2018352658-A1 · Dec 6, 2018 · US
Method for cleaning an Electronic circuit board
US-10144078-B2 · Dec 4, 2018 · US
Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates
US-10143086-B2 · Nov 27, 2018 · US
Use of combined masking techniques and/or combined material removal techniques to protectively coat electronic devices
US-10098236-B2 · Oct 9, 2018 · US
Printed circuits with laser ablated conformal coating openings
US-10098237-B2 · Oct 9, 2018 · US
Electronic device and method for producing same
US-2018255667-A1 · Sep 6, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/288?
- CPC H05K3/288 is the Cooperative Patent Classification code for “Removal of non-metallic coatings, e.g. for repairing.”
- How many patents are filed under CPC H05K3/288 (Removal of non-metallic coatings, e.g. for repairing)?
- Our database includes 115 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/288 growing?
- Publication counts under this code: 7 in 2024 vs 6 in 2025 (latest complete years).