Method for cleaning an Electronic circuit board

Patent metadata

Field	Value
Publication number	US-10144078-B2
Application number	US-201815876527-A
Country	US
Kind code	B2
Filing date	Jan 22, 2018
Priority date	Jul 25, 2014
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

A method for cleaning an electronic circuit board is disclosed. The electronic circuit board is provided with a substrate layer and a copper layer. A solder mask is applied to the electronic circuit board and a channel is formed in the solder mask. The channel includes an inlet and an outlet. A component is affixed to the electronic circuit board over the channel and cleaning fluid is passed through the channel to remove residual solder flux from between the component and the electronic circuit board.

First claim

What is claimed is:

1. A method for fabricating an electronic circuit board having a base substrate layer and a copper layer over the base substrate layer, the method comprising:
applying a solder mask to the base substrate layer and the copper layer;
forming a channel in the solder mask, the channel having:
a main channel portion formed in the solder mask, wherein walls of the main channel portion are formed by interior edges of the copper pads and the main channel portion has a selected width,
an inlet formed in the solder mask extending beyond the component at one end of the main channel portion, wherein the inlet is in a shape of an equilateral triangle having one side corresponding to the width of the main channel portion and two sides converging to a point, wherein a depth of the inlet is substantially negligible at the point and increases linearly to the depth of the main channel portion, and
an outlet formed in the solder mask extending beyond the component at another end of the main channel portion opposite the inlet, wherein the outlet is in a shape of an equilateral triangle having one side corresponding to the width of the main channel portion and two sides converging to a point, wherein a depth of the inlet is substantially negligible at the point and increases linearly to the depth of the main channel portion;

affixing a component to a pad formed on the copper layer, wherein the component is disposed above the channel such that the inlet and the outlet extend beyond the component; and
passing a fluid through the channel.

2. The method of claim 1 , wherein the channel is configured to have a clearance of at least 2 mils (50.8 micrometers) between a bottom of the channel and the component.

3. The method of claim 1 , wherein the inlet and the outlet each have at least one edge that is the same length as a width of the channel.

4. The method of claim 1 , wherein a shape of the inlet is configured to create turbulent flow in the channel.

5. The method of claim 1 , wherein the channel is formed between a first solder pad and a second solder pad that connects the component to the copper layer.

6. The method of claim 1 , further comprising affixing an at least one additional component to the copper layer, wherein the at least one additional component is disposed above the channel and the inlet and the outlet extend underneath the component and the at least one additional component.

7. A method for cleaning an electronic circuit board having a base substrate layer and a copper layer over the base substrate layer, the method comprising:
forming a solder mask over the base substrate layer and the copper layer
forming a channel in the solder mask, the channel having:
a main channel portion formed in the solder mask, wherein walls of the main channel portion are formed by interior edges of the copper pads and the main channel portion has a selected width,
an inlet formed in the solder mask extending beyond the component at one end of the main channel portion, wherein the inlet is in a shape of an equilateral triangle having one side corresponding to the width of the main channel portion and two sides converging to a point, wherein a depth of the inlet is substantially negligible at the point and increases linearly to the depth of the main channel portion, and
an outlet formed in the solder mask extending beyond the component at another end of the main channel portion opposite the inlet, wherein the outlet is in a shape of an equilateral triangle having one side corresponding to the width of the main channel portion and two sides converging to a point, wherein a depth of the inlet is substantially negligible at the point and increases linearly to the depth of the main channel portion;

affixing a component to a pad formed on the copper layer and disposed over the channel;
directing a cleaning solution into the channel via the inlet; and
expelling the cleaning solution via the outlet of the channel to clean a region of the electronic circuit board underneath the component.

8. The method of claim 7 , wherein the channel is configured to have a clearance of at least 2 mils (50.8 micrometers) between a bottom of the channel and the component.

9. The method of claim 7 , wherein the inlet and the outlet each have at least one edge that is the same length as a width of the channel.

10. The method of claim 7 , wherein the inlet is configured to create turbulent flow in the channel.

11. The method of claim 7 , wherein the channel is formed between a first solder pad and a second solder pad of the electronic circuit board and the component is attached to the first solder pad and the second pad to be disposed above the channel.

12. The method of claim 7 , wherein the electronic circuit board further includes an at least one additional component attached to the copper layer, wherein the at least one additional component is disposed above the channel and the inlet and the outlet extend underneath the component and the at least one additional component.

13. The method of claim 7 , wherein the region of the electronic circuit board underneath the component includes at least one solder ball to be expelled with the cleaning solution.

Assignees

• Raytheon Co

Inventors

• Vuono William R
• Beair William D

Classifications

• H05K1/0272

  Adaptations for fluid transport, e.g. channels, holes · CPC title

• H05K3/26

  Cleaning or polishing of the conductive pattern · CPC title

• H05K3/3452

  Solder masks · CPC title

• H05K2203/041

  Solder preforms in the shape of solder balls · CPC title

• B23K1/206 Primary

  Cleaning · CPC title