Conformal coating materials

Patent metadata

Field	Value
Publication number	US-10257940-B2
Application number	US-201715426696-A
Country	US
Kind code	B2
Filing date	Feb 7, 2017
Priority date	Jul 23, 2015
Publication date	Apr 9, 2019
Grant date	Apr 9, 2019

Abstract

In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a first conformal coating material to a DFSM material. The first conformal coating material includes a first functional group, and the DFSM material includes a second functional group that is different from the first functional group. The process also includes reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group.

First claim

The invention claimed is:

1. A printed circuit board comprising:
a printed circuit board (PCB) substrate;
a dry film solder mask (DFSM) material overlying a first portion of the PCB substrate; and
a conformal coating material chemically and reversibly bonded to the DFSM material via a cyclic compound, wherein the conformal coating material is derived from a compound comprising a dienophile functional group.

2. The printed circuit board of claim 1 , wherein the conformal coating material includes an epoxy material.

3. The printed circuit board of claim 1 , further comprising a plurality of circuit elements overlying a second portion of the PCB substrate, wherein the conformal coating material overlies the second portion of the PCB substrate.

4. The printed circuit board of claim 1 , wherein the cyclic compound includes a bicyclic compound, and wherein the cyclic compound comprises a byproduct of a chemical reaction of a first functional group and a second functional group.

5. The printed circuit board of claim 1 , wherein the dienophile functional group comprises a cyclic alkene functional group.

6. The printed circuit board of claim 1 , wherein the dienophile functional group comprises a maleimide functional group.

7. The printed circuit board of claim 1 , wherein the DFSM material is derived from a compound comprising a diene functional group.

8. The printed circuit board of claim 7 , wherein the diene functional group comprises a furan functional group.

9. A printed circuit board comprising:
a printed circuit board (PCB) substrate;
a dry film solder mask (DFSM) material overlying a first portion of the PCB substrate, wherein the DFSM material is derived from a compound comprising a dienophile functional group; and
a conformal coating material reversibly bonded to the DFSM material via a cyclic compound.

10. The printed circuit board of claim 9 , wherein the conformal coating material includes an epoxy material.

11. The printed circuit board of claim 9 , further comprising a plurality of circuit elements overlying a second portion of the PCB substrate, wherein the conformal coating material overlies the second portion of the PCB substrate.

12. The printed circuit board of claim 9 , wherein the cyclic compound includes a bicyclic compound, and wherein the cyclic compound comprises a byproduct of a chemical reaction of a first functional group and a second functional group.

13. The printed circuit board of claim 9 , wherein the conformal coating material is derived from a compound comprising a diene functional group.

14. The printed circuit board of claim 9 , wherein the conformal coating material is derived from a compound comprising a cyclic diene functional group.

15. The printed circuit board of claim 9 , wherein the dienophile functional group comprises a cyclic alkene functional group.

Assignees

• IBM

Inventors

• Czaplewski Sarah K
• Kuczynski Joseph
• Wertz Jason T
• Zhang Jing

Classifications

• H05K3/0058

  Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence) · CPC title

• H05K3/28 Primary

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K1/02

  Details · CPC title

• H05K2203/1322

  Encapsulation comprising more than one layer · CPC title

• C09D163/00

  Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title