Printed circuits with laser ablated conformal coating openings

US10098237B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10098237-B2
Application numberUS-201615056291-A
CountryUS
Kind codeB2
Filing dateFeb 29, 2016
Priority dateMar 2, 2015
Publication dateOct 9, 2018
Grant dateOct 9, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Electrical components may be mounted on a printed circuit or other substrate. The electrical components may be covered with a conformal coating containing a wavelength-tuned-light-absorption-enhancement additive. The additive may be a dye or other additive that creates a light absorption peak at a given wavelength. To form openings in the conformal coating in alignment with the electrical components without damaging the components, a laser ablation tool may apply laser light at the given wavelength to the conformal coating. Openings may also be formed by placing tape over the components before the con form at coating is applied. The tape may have a color with a light absorption peak at the given wavelength to facilitate the formation of openings without damaging sensitive components.

First claim

Opening claim text (preview).

What is claimed is: 1. Apparatus, comprising: a substrate; an electrical component mounted on the substrate; and a conformal coating on the substrate with a wavelength-tuned-light-absorption-enhancement additive and a laser-ablated opening through the conformal coating, wherein the laser-ablated opening directly overlaps the electrical component and wherein the wavelength-tuned-light-absorption-enhancement additive has a light absorption peak at a wavelength chosen from the group of wavelengths consisting of: an ultraviolet light wavelength, a visible light wavelength, and an infrared light wavelength. 2. The apparatus defined in claim 1 wherein the conformal coating is selected from the group consisting of: acrylic, epoxy, silicone, polyurethane, parylene, and fluoropolymer. 3. The apparatus defined in claim 2 wherein the wavelength-tuned-light-absorption-enhancement additive has a light absorption peak at an ultraviolet light wavelength. 4. The apparatus defined in claim 2 wherein the wavelength-tuned-light-absorption-enhancement additive has a light absorption peak at a visible light wavelength. 5. The apparatus defined in claim 2 wherein the wavelength-tuned-light-absorption-enhancement additive has a light absorption peak at an infrared light wavelength. 6. The apparatus defined in claim 1 wherein the substrate comprises a printed circuit. 7. The apparatus defined in claim 6 wherein the wavelength-tuned-light-absorption-enhancement additive has a light absorption peak at a visible light wavelength. 8. The apparatus defined in claim 6 wherein the printed circuit has a contact pad and wherein the opening overlaps the contact pad. 9. The apparatus defined in claim 8 wherein the wavelength-tuned-light-absorption-enhancement additive has a light absorption peak at a visible light wavelength. 10. The apparatus defined in claim 1 wherein the wavelength-tuned-light-absorption-enhancement additive comprises a dye. 11. The apparatus defined in claim 10 wherein the dye has a light absorption peak at a visible wavelength or at an infrared wavelength. 12. The apparatus defined in claim 11 wherein the substrate comprises a printed circuit, wherein the printed circuit has a contact pad, wherein the electrical component is mounted on the printed circuit, and wherein the opening overlaps. 13. Apparatus, comprising: a substrate; a component mounted on the substrate; tape that absorbs laser light at a laser wavelength that is provided by a laser ablation tool, wherein the tape has a color with a light absorption peak at the laser wavelength; and a conformal coating on the substrate that overlaps at least some of the tape, wherein there is an opening through the conformal coating and the tape that exposes at least a portion of the component. 14. The apparatus defined in claim 13 wherein the conformal coating is selected from the group consisting of: acrylic, epoxy, silicone, polyurethane, parylene, and fluoropolymer. 15. The apparatus defined in claim 13 wherein the opening through the conformal coating directly overlaps the component. 16. The apparatus defined in claim 15 wherein the opening extends completely through the conformal coating and the tape. 17. The apparatus defined in claim 16 wherein the tape and the conformal coating overlap the printed circuit board and the component and wherein there is an additional opening that exposes at least a portion of the printed circuit board. 18. The apparatus defined in claim 13 wherein the apparatus comprises an interior and an exterior, wherein the tape and the conformal coating separate the interior from the exterior, and wherein the opening through the conformal coating and the tape exposes the component to the exterior of the apparatus. 19. Apparatus, comprising: a substrate; a conformal coating on the substrate with a wavelength-tuned-light-absorption-enhancement additive and a laser-ablated opening through the coating, wherein the wavelength-tuned-light-absorption-enhancement additive has a light absorption peak at a wavelength chosen from a group of wavelengths consisting of: an ultraviolet light wavelength, a visible light wavelength, and an infrared light wavelength. 20. The apparatus defined in claim 19 wherein the apparatus has an interior and an exterior and wherein the conformal coating separates the interior from the exterior, the apparatus further comprising: an electrical component mounted on the substrate, wherein the laser-ablated opening through the conformal coating exposes the electrical component to the exterior of the apparatus.

Assignees

Inventors

Classifications

  • H05K3/288Primary

    Removal of non-metallic coatings, e.g. for repairing · CPC title

  • Silicon containing polymer, e.g. silicone · CPC title

  • Using laser light · CPC title

  • for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

  • Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title

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Frequently asked questions

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What does patent US10098237B2 cover?
Electrical components may be mounted on a printed circuit or other substrate. The electrical components may be covered with a conformal coating containing a wavelength-tuned-light-absorption-enhancement additive. The additive may be a dye or other additive that creates a light absorption peak at a given wavelength. To form openings in the conformal coating in alignment with the electrical compo…
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification H05K3/288. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).