Electronic device and method for producing same

Patent metadata

Field	Value
Publication number	US-10375867-B2
Application number	US-201715756114-A
Country	US
Kind code	B2
Filing date	Mar 27, 2017
Priority date	Apr 27, 2016
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

The present invention provides an electronic device which includes an electromagnetic shield, can keep down a production cost, can be made to have a reduced thickness, and has a high degree of freedom in designing a wiring circuit. Further, the present invention provides a method for producing such an electronic device. The electronic device (1A) includes at least one high frequency functional component (21), an electrically conductive member (10) which electromagnetically shields the at least one high frequency functional component (21), and a resin molded body (23) in which at least part of the high frequency functional component (21) and at least part of the electrically conductive member (10) are embedded and fixed.

First claim

The invention claimed is:

1. An electronic device comprising:
at least one electronic component;
an electrically conductive member which electromagnetically shields the at least one electronic component;
a resin molded body in which at least part of the at least one electronic component and at least part of the electrically conductive member which electromagnetically shields the at least one electronic component are embedded and fixed;
a first electronic component which is the at least one electronic component that is electromagnetically shielded; and
a second electronic component which is not electromagnetically shielded, wherein:
the second electronic component is at least partially embedded in the resin molded body;
the first electronic component is fixed with an insulating member that is provided in a space surrounded by the electrically conductive member;
at least part of the insulating member is embedded in the resin molded body together with at least part of the first electronic component and at least part of the electrically conductive member;
the electrically conductive member includes a first electrically conductive member which is embedded in the resin molded body, a second electrically conductive member which is not embedded in the resin molded body, and at least one third electrically conductive member which is provided between the first electrically conductive member and the second electrically conductive member;
the first electrically conductive member and the second electrically conductive member are electrically connected with each other via the at least one third electrically conductive member;
an electrode of the first electronic component is connected with an electrode of the second electronic component on a surface of the resin molded body and on a surface of the insulating member, which is embedded in the resin molded body, via wiring connection such that a wire of the wiring connection connecting the electrode of the first electronic component with the electrode of the second electronic component does not contact with the at least one third electrically conductive member; and
a part between the wire of the wiring connection and the second electrically conductive member is insulated with an insulating member which is not embedded in the resin molded body or with air.

2. The electronic device as set forth in claim 1 , wherein the electrode of the first electronic component and the electrode of the second electronic component are flush with or substantially flush with the surface of the resin molded body.

3. The electronic device as set forth in claim 1 , wherein the second electrically conductive member has an opening which is provided immediately above at least one of the first electronic component.

4. The electronic device as set forth in claim 2 , wherein the wiring connection is formed by printing with use of an electrically conductive material.

5. A method for producing an electronic device recited in claim 1 , said method comprising:
an attaching/temporarily-fixing step of attaching and temporarily fixing at least one electronic component to a temporarily-fixing member;
a first electromagnetically shielding step of covering the at least one electronic component with a first insulating member and a first electrically conductive member so as to electromagnetically shield the at least one electronic component;
a resin molding step of placing the temporarily-fixing member inside a molding die after the first electromagnetically shielding step in a state in which the at least one electronic component, the first insulating member, and the first electrically conductive member are temporarily fixed to the temporarily-fixing member, and carrying out resin molding so that each of the at least one electronic component, the first insulating member, and the first electrically conductive member is at least partially embedded in a resin molded body;
a taking-out step of separating the temporarily-fixing member from the resin molded body which has been made in the resin molding step; and
a second electromagnetically shielding step of covering, after the taking-out step, the at least one electronic component with a second electrically conductive member so as to electromagnetically shield the at least one electronic component on a side opposite to a side on which the first electrically conductive member is provided.

6. The method as set forth in claim 5 , wherein:
in the attaching/temporarily-fixing step, an electrically conductive thin plate which has electrical conductivity is attached to the temporarily-fixing member;
the method further includes, after the taking-out step and before the second electromagnetically shielding step, a circuit forming step of forming a wiring circuit, which is connected with an electrode of the at least one electronic component, on a surface formed by the resin molded body and the first insulating member such that a wire does not make contact with the electrically conductive thin plate; and
in the second electromagnetically shielding step, a second insulating member is stacked on the wiring circuit and the at least one electronic component in a part excluding the electrically conductive thin plate, and then a second electrically conductive member is stacked on a region in which the at least one electronic component is embedded and which includes the electrically conductive thin plate.

7. The method as set forth in claim 6 , wherein the first insulating member, the first electrically conductive member, the second insulating member, the second electrically conductive member, and the wiring circuit are formed by ink-jet printing.

8. The method as set forth in claim 6 , wherein in the circuit forming step, the wiring circuit is formed by printing wiring by spraying electrically conductive ink.

9. The electronic device as set forth in claim 1 , wherein each of the first electrically conductive member and the second electrically conductive member comprises a thin film having a thickness of 1 μm to 10 μm.

10. The electronic device as set forth in claim 1 , wherein the at least one third electrically conductive member comprises a metallic member having a thickness of 0.1 mm or more.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Kawai Wakahiro

Classifications

• H10W74/016

  using moulds · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/019 Primary

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title