Substrate for printed circuit board and method for producing substrate for printed circuit board
US-2017347449-A1 · Nov 30, 2017 · US
Reinforcing of the conductive pattern {(by solder coating H05K3/3465)}
Reinforcing of the conductive pattern {(by solder coating H05K3/3465)} · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/24 |
| Official title | Reinforcing of the conductive pattern {(by solder coating H05K3/3465)} |
| Display label | Reinforcing of the conductive pattern {(by solder coating H05K3/3465)} |
| Total patents | 218 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 19 |
| 2017 | 23 |
| 2018 | 18 |
| 2019 | 15 |
| 2020 | 23 |
| 2021 | 12 |
| 2022 | 27 |
| 2023 | 21 |
| 2024 | 21 |
| 2025 | 19 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material
US-2017347464-A1 · Nov 30, 2017 · US
Method and apparatus for electrolytically depositing a deposition metal on a workpiece
US-2017335485-A1 · Nov 23, 2017 · US
POWER MODULE SUBSTRATE WITH Ag UNDERLAYER AND POWER MODULE
US-2017294399-A1 · Oct 12, 2017 · US
Copper foil with carrier
US-9788423-B2 · Oct 10, 2017 · US
Plating bath composition and method for electroless plating of palladium
US-9758874-B2 · Sep 12, 2017 · US
Printed circuit board and method of fabricating the same
US-2017251556-A1 · Aug 31, 2017 · US
Method and apparatus for electrolytically depositing a deposition metal on a workpiece
US-9745665-B2 · Aug 29, 2017 · US
Electroless surface treatment plated layers of printed circuit board and method for preparing the same
US-9743508-B2 · Aug 22, 2017 · US
Method For Producing A Foil Arrangement And Corresponding Foil Arrangement
US-2017215289-A1 · Jul 27, 2017 · US
Opto-electric hybrid board, and production method therefor
US-9703057-B2 · Jul 11, 2017 · US
Printed circuit board and method of fabricating the same
US-9686860-B2 · Jun 20, 2017 · US
Electronic component-embedded module and communication terminal device
US-2017171966-A1 · Jun 15, 2017 · US
Method of forming metallic pattern on polymer substrate
US-9657404-B2 · May 23, 2017 · US
Printed circuit board, electronic component, and method for producing printed circuit board
US-2017135206-A1 · May 11, 2017 · US
Display device and method for manufacturing the same
US-2017135213-A1 · May 11, 2017 · US
Electrical conductors, production methods thereof, and electronic devices including the same
US-9648738-B2 · May 9, 2017 · US
Plating bath composition and method for electroless plating of palladium
US-2017121823-A1 · May 4, 2017 · US
Electronic component-embedded module and communication terminal device
US-9596764-B2 · Mar 14, 2017 · US
Electrical conductors, production methods thereof, and electronic devices including the same
US-2017064822-A1 · Mar 2, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/24?
- CPC H05K3/24 is the Cooperative Patent Classification code for “Reinforcing of the conductive pattern {(by solder coating H05K3/3465)}.”
- How many patents are filed under CPC H05K3/24 (Reinforcing of the conductive pattern {(by solder coating H05K3/3465)})?
- Our database includes 218 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/24 growing?
- Publication counts under this code: 21 in 2024 vs 19 in 2025 (latest complete years).