Substrate for printed circuit board and method for producing substrate for printed circuit board

Patent metadata

Field	Value
Publication number	US-2017347449-A1
Application number	US-201515536954-A
Country	US
Kind code	A1
Filing date	Dec 18, 2015
Priority date	Dec 22, 2014
Publication date	Nov 30, 2017
Grant date	—

Abstract

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a metal layer formed on at least one surface side of the base film. In the substrate for a printed circuit board, a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal. The fine particles preferably have an average particle size of 0.1 nm or more and 20 nm or less. The fine particles are preferably formed of a metal oxide or a metal hydroxide. The fine particles are preferably present between the base film and the metal layer so as to form a layer. The metal layer preferably includes a metal grain layer formed by firing metal nanoparticles.

First claim

1 . A substrate for a printed circuit board, comprising:
a base film having an insulating property; and a metal layer formed on at least one surface side of the base film, wherein a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal.

2 . The substrate for a printed circuit board according to claim 1 , wherein the fine particles have an average particle size of 0.1 nm or more and 20 nm or less.

3 . The substrate for a printed circuit board according to claim 1 , wherein the fine particles are formed of a metal oxide or a metal hydroxide.

4 . The substrate for a printed circuit board according to claim 1 , wherein the fine particles are present between the base film and the metal layer so as to form a layer.

5 . The substrate for a printed circuit board according to claim 1 , wherein the metal layer includes a metal grain layer formed by firing metal nanoparticles.

6 . The substrate for a printed circuit board according to claim 5 , wherein the metal layer further includes a plating layer on one surface side of the metal grain layer, the plating layer being formed by electroless plating or electroplating.

7 . The substrate for a printed circuit board according to claim 1 , wherein the main metal is copper.

8 . The substrate for a printed circuit board according to claim 1 , wherein an oxygen content in a region of the base film, the region extending from a surface on the metal layer side to a depth of 50 nm, is 20 atomic percent or more and 60 atomic percent or less.

9 . A method for producing a substrate for a printed circuit board,
the substrate including a base film having an insulating property, and a metal layer formed on at least one surface side of the base film, the method comprising: a step of applying a conductive composition containing metal nanoparticles onto one surface side of the base film; and a step of firing the applied conductive composition, wherein the firing step includes a step of forming a plurality of fine particles between the base film and the metal layer, the fine particles being formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal.

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Printed Circuits Inc

Inventors

• Sugiura Motohiko
• Kasuga Takashi
• Oka Yoshio
• UEMURA Shigeaki
• Park Jinjoo
• Ueda Hiroshi
• Miura Kousuke

Classifications

• H05K3/388

  by the use of a metallic or inorganic thin film adhesion layer · CPC title

• H05K3/24

  Reinforcing of the conductive pattern {(by solder coating H05K3/3465)} · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2201/0269

  Non-uniform distribution or concentration of particles · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title