Method of forming metallic pattern on polymer substrate

Patent metadata

Field	Value
Publication number	US-9657404-B2
Application number	US-201414316809-A
Country	US
Kind code	B2
Filing date	Jun 27, 2014
Priority date	Jun 27, 2014
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.

First claim

What is claimed is:

1. A method of forming a metallic pattern on a polymer substrate, comprising:
providing a polymer substrate, wherein a material of the polymer substrate includes nylons, polycarbonates (PC), acrylonitrile butadiene styrene (ABS), PC/ABS, polyethylene terephthalate (PET), polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE) or liquid crystal polymers (LCP);
forming a mixture layer on a surface of the polymer substrate, wherein the mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium, wherein a material of the active carrier medium includes polyvinylpyrrolidone (PVP) or polyethylene oxide (PEO);
fusing the nanoparticles in a portion of the mixture layer by treating the mixture layer with a laser process for forming a conductive pattern on the surface of the polymer substrate, wherein the nanoparticles are fused together through the heat generated from the nanoparticles during the laser process, and wherein the laser process is performed by using a UV laser at 355 nm with a power of 0.2˜0.4 W and 80% overlapping and the laser process is a laser ablation process;
performing a cleaning process to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate; and
subjecting the conductive pattern on the polymer substrate to an electroplating process to form the metallic pattern on the conductive pattern.

2. The method according to claim 1 , wherein a material of the nanoparticles includes copper oxide, copper, silver or gold.

3. The method according to claim 1 , wherein a material of the nanoparticles includes copper oxide.

4. The method according to claim 3 , wherein the conductive pattern is a copper layer.

5. The method according to claim 3 , wherein the electroplating process includes a copper electroplating process and the metallic pattern includes a copper pattern.

6. The method according to claim 1 , wherein the nanoparticles have an average size below 100 nm.

7. The method according to claim 1 , wherein a content of the nanoparticles in the mixture layer ranges from 20 wt % to 40 wt %, relative to a total weight of the mixture layer.

8. The method according to claim 1 , wherein forming the mixture layer includes forming the mixture layer by spraying, spin coating, dip coating, screen printing, pad printing or smearing.

9. The method according to claim 1 , wherein a position of the conductive pattern corresponds to a position of the metallic pattern.

Assignees

• Wistron Neweb Corp

Inventors

• Radi Babak
• Chen Shih-Hong
• Kuo Yu-Fu
• Chuang Tzu-Wen

Classifications

• H05K3/105

  by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam · CPC title

• H05K2201/0257

  Nanoparticles · CPC title

• H05K2203/107

  Using laser light · CPC title

• H05K3/24

  Reinforcing of the conductive pattern {(by solder coating H05K3/3465)} · CPC title

• C25D5/56

  of plastics · CPC title