Method of manufacturing printed circuit board
US-2024414849-A1 · Dec 12, 2024 · US
US9648738B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9648738-B2 |
| Application number | US-201615235363-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 12, 2016 |
| Priority date | Sep 2, 2015 |
| Publication date | May 9, 2017 |
| Grant date | May 9, 2017 |
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An electrical conductor includes a first conductive layer including a plurality of metal oxide nanosheets, wherein a metal oxide nanosheet of the plurality of metal oxide nanosheets includes a proton bonded to a the surface of the metal oxide nanosheet, wherein the metal oxide is represented by Chemical Formula 1: MO 2 Chemical Formula 1 wherein M is Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, or Mn, wherein the plurality of metal oxide nanosheets has a content of hydrogen atoms of less than about 100 atomic percent, with respect to 100 atomic percent of metal atoms as measured by Rutherford backscattering spectrometry, and wherein the plurality of metal oxide nanosheets includes an electrical connection between contacting metal oxide nanosheets.
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What is claimed is: 1. An electrical conductor comprising: a first conductive layer comprising a plurality of metal oxide nanosheets, wherein a metal oxide nanosheet of the plurality of metal oxide nanosheets comprises a proton bonded to a surface of the metal oxide nanosheet, wherein the metal oxide nanosheet is represented by Chemical Formula 1 MO 2 Chemical Formula 1 wherein M is Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, or Mn, wherein the plurality of metal oxide nanosheets has a content of hydrogen atoms of less than about 100 atomic percent, with respect to 100 atomic percent of metal atoms, when measured by Rutherford backscattering spectrometry, and wherein the plurality of metal oxide nanosheets comprises an electrical connection between contacting metal oxide nanosheets. 2. The electrical conductor of claim 1 , wherein the plurality of metal oxide nanosheets has a content of hydrogen atoms of less than about 60 atomic percent, with respect to 100 atomic percent of metal atoms, when measured by Rutherford backscattering spectrometry. 3. The electrical conductor of claim 1 , wherein the electrical conductor has a transmittance of greater than or equal to about 85% for light having a wavelength of 550 nm at a thickness of about 100 nm. 4. The electrical conductor of claim 1 , wherein the metal oxide nanosheets of the plurality of metal oxide nanosheets have an average lateral size of greater than or equal to about 0.5 micrometers and less than or equal to about 100 micrometers, and have a thickness of less than or equal to about 3 nanometers. 5. The electrical conductor of claim 1 , wherein the first conductive layer is a discontinuous layer comprising a space between adjacent metal oxide nanosheets of the plurality of metal oxide nanosheets, and wherein an area ratio of the space to the total area of the first conductive layer is less than or equal to about 50 percent. 6. The electrical conductor of claim 1 , wherein the metal oxide nanosheets have peaks of a T structure when analyzed by X-ray diffraction analysis. 7. The electrical conductor of claim 1 , wherein the first conductive layer further comprises a binder. 8. The electrical conductor of claim 1 , wherein the first conductive layer further comprises an overcoating layer, wherein the overcoating layer is on the first conductive layer and comprises a thermosetting resin, an ultraviolet-curable resin, or a combination thereof. 9. A method of producing an electrical conductor of claim 1 , the method comprising: providing a first conductive layer including a plurality of metal oxide nanosheets, wherein a metal oxide nanosheet of the plurality of metal oxide nanosheets comprises a proton bonded to a surface of the metal oxide nanosheet, and wherein the metal oxide nanosheet is represented by Chemical Formula 1 MO 2 Chemical Formula 1 wherein M is Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, or Mn, and heating the first conductive layer to produce the electrical conductor, wherein the heating is performed to provide a content of hydrogen atoms of less than about 100 atomic percent, with respect to 100 atomic percent of metal atoms, when measured by Rutherford backscattering spectrometry, and wherein the plurality of metal oxide nanosheets comprises an electrical connection between contacting metal oxide nanosheets. 10. The method of claim 9 , wherein the providing a first conductive layer further comprises intercalating a sodium-substituted layered metal oxide with an intercalant, wherein the intercalant comprises an ammonium compound, an amine compound, or a combination thereof to provide the plurality of nanosheets. 11. The method of claim 9 , wherein the plurality of nanosheets have peaks of a T structure when analyzed by X-ray diffraction. 12. The method of claim 9 , wherein the heating is performed at a temperature of greater than or equal to about 80° C. 13. The method of claim 9 , wherein the heating is performed at a temperature of greater than about 100° C. and less than or equal to about 200° C. 14. The method of claim 9 , wherein the heating is performed to provide a content of hydrogen atoms, relative to 100 atomic percent of metal atoms, of less than about 60 atomic percent, when the metal oxide nanosheets are analyzed by Rutherford backscattering spectrometry. 15. An electronic device comprising the electrical conductor of claim 1 . 16. The electronic device of claim 15 , wherein the electronic device is a flat panel display, a touch screen panel, a solar cell, an e-window, an electrochromic mirror, a heat mirror, a transparent transistor, or a flexible display.
Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating · CPC title
Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO] · CPC title
Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer · CPC title
Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title
Use of materials for the {conductive, e.g. } metallic pattern · CPC title
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