Thinned electronic product and manufacturing method thereof
US-10123423-B1 · Nov 6, 2018 · US
using a prefabricated paste pattern, ink pattern or powder pattern
using a prefabricated paste pattern, ink pattern or powder pattern · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/207 |
| Official title | {using a prefabricated paste pattern, ink pattern or powder pattern} |
| Display label | using a prefabricated paste pattern, ink pattern or powder pattern |
| Total patents | 163 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 22 |
| 2016 | 12 |
| 2017 | 20 |
| 2018 | 14 |
| 2019 | 22 |
| 2020 | 17 |
| 2021 | 17 |
| 2022 | 11 |
| 2023 | 9 |
| 2024 | 7 |
| 2025 | 10 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Wiring body, wiring board, and touch sensor
US-10101865-B2 · Oct 16, 2018 · US
Direct chip attach using embedded traces
US-10085341-B2 · Sep 25, 2018 · US
Stretchable and foldable electronic devices
US-10064269-B2 · Aug 28, 2018 · US
Stretchable cable and stretchable circuit board
US-2018070446-A1 · Mar 8, 2018 · US
Electrical components and method of manufacture
US-9905928-B2 · Feb 27, 2018 · US
Method for fabricating flexible substrate
US-2017374737-A1 · Dec 28, 2017 · US
Transparent electrode and manufacturing method thereof
US-9826636-B2 · Nov 21, 2017 · US
Wiring body, wiring board, and touch sensor
US-2017293382-A1 · Oct 12, 2017 · US
Wiring body, wiring board, touch sensor and method for producing wiring body
US-2017285786-A1 · Oct 5, 2017 · US
Method for producing conductor-layer-provided structure, substrate-provided wiring body, substrate-provided structure, and touch sensor
US-2017277289-A1 · Sep 28, 2017 · US
Wiring body, wiring board, and touch sensor
US-2017277290-A1 · Sep 28, 2017 · US
Printed wiring board and method of producing the same
US-2017273197-A1 · Sep 21, 2017 · US
Electronic package
US-2017231095-A1 · Aug 10, 2017 · US
Flexible substrate embedded with wires and method for fabricating the same
US-9707706-B2 · Jul 18, 2017 · US
Method for applying dried metal sintering compound by means of a transfer substrate onto a carrier for electronic components, corresponding carrier, and the use thereof for sintered connection to electronic components
US-2017194169-A1 · Jul 6, 2017 · US
Method for forming pattern
US-9697954-B2 · Jul 4, 2017 · US
Structural body and wireless communication apparatus
US-9698475-B2 · Jul 4, 2017 · US
Direct chip attach using embedded traces
US-2017188460-A1 · Jun 29, 2017 · US
Flexible printed circuit board and method for manufacturing same
US-9648753-B2 · May 9, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/207?
- CPC H05K3/207 is the Cooperative Patent Classification code for “using a prefabricated paste pattern, ink pattern or powder pattern.”
- How many patents are filed under CPC H05K3/207 (using a prefabricated paste pattern, ink pattern or powder pattern)?
- Our database includes 163 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/207 growing?
- Publication counts under this code: 7 in 2024 vs 10 in 2025 (latest complete years).