Structural body and wireless communication apparatus

Patent metadata

Field	Value
Publication number	US-9698475-B2
Application number	US-201414437408-A
Country	US
Kind code	B2
Filing date	Jan 23, 2014
Priority date	Mar 21, 2013
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A first resin layer ( 11 ) is provided with a first through hole ( 12 ), a conductive pattern ( 31, 41, 51 ) extends from a first surface of the first resin layer ( 11 ) to a second surface of the first resin layer ( 11 ) through the first through hole ( 12 ), and a second resin layer ( 21 ) is provided with a first protrusion ( 22 ) which fills at least a portion of the first through hole ( 12 ).

First claim

The invention claimed is:

1. A structure comprising:
a first resin layer on whose surface the conductive pattern is formed; and a second resin layer formed on the first resin layer so that the conductive pattern is sandwiched between the first resin layer and the second resin layer, the first resin layer being provided with a first through hole,
the conductive pattern extending from a first surface of the first resin layer to a second surface of the first resin layer through the first through hole, the first surface being on a side provided with the second resin layer, the second surface being on an opposite side to the side provided with the second resin layer side,
the second resin layer having a first protrusion which fills at least a portion of the first through hole, wherein:
the first resin layer is further provided with a second through hole; the conductive pattern extends, at an end of the conductive pattern, from the first surface to the second surface through the first through hole;
the conductive pattern extends, at another end side of the conductive pattern, from the first surface to the second surface through the second through hole; and
the second resin layer is further provided with a second protrusion which fills at least a portion of the second through hole, wherein the conductive pattern includes an antenna.

2. The structure according to claim 1 , wherein a top end of the first protrusion is
larger than a base of the first protrusion.

3. A wireless communication apparatus comprising: a housing including the structure according to claim 2 .

4. The structure according to claim 1 , wherein the first protrusion
has a plug-form part on the second surface, the plug-form part being provided so as to cover the first through hole.

5. A wireless communication apparatus comprising: a housing including the structure according to claim 4 .

6. A wireless communication apparatus comprising: a housing including the structure according to claim 1 .

7. The structure according to claim 2 , wherein
the first protrusion has a plug-form part on the second surface, the plug-form part being provided so as to cover the first through hole.

8. The structure according to claim 1 , wherein
the first protrusion has a plug-form part on the second surface, the plug-form part being provided so as to cover the first through hole.

9. A wireless communication apparatus comprising: a housing including the structure according to claim 1 .

10. A structure comprising:
a first resin layer on whose surface the conductive pattern is formed; and a second resin layer formed on the first resin layer so that the conductive pattern is sandwiched between the first resin layer and the second resin layer, the first resin layer being provided with a first through hole,
the conductive pattern extending from a first surface of the first resin layer to a second surface of the first resin layer through the first through hole, the first surface being on a side provided with the second resin layer, the second surface being on an opposite side to the side provided with the second resin layer side,
the second resin layer having a first protrusion which fills at least a portion of the first through hole,
wherein:
the first resin layer is further provided with a second through hole; the conductive pattern extends, at an end of the conductive pattern, from the first surface to the second surface through the first through hole;
the conductive pattern extends, at another end side of the conductive pattern, from the first surface to the second surface through the second through hole; and
the second resin layer is further provided with a second protrusion which fills at least a portion of the second through hole, wherein the conductive pattern includes an antenna.

Assignees

• Sharp Kk

Inventors

• Katayama Tomofumi

Classifications

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• H01Q1/38 Primary

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H05K2201/0999

  Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing · CPC title

• H01Q1/243

  with built-in antennas · CPC title