Wiring body, wiring board, and touch sensor

US10101865B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10101865-B2
Application numberUS-201615508853-A
CountryUS
Kind codeB2
Filing dateJan 29, 2016
Priority dateJan 30, 2015
Publication dateOct 16, 2018
Grant dateOct 16, 2018

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A wiring body includes a conductive portion that includes a contact surface having a concave-convex shape, and an adhesive layer stacked on the contact surface. The conductive portion further includes a top surface facing the contact surface that contains conductive particles. The adhesive layer includes a smooth portion with a smooth main surface provided at a constant thickness, and a protrusion that protrudes from the main surface toward a side of the conductive portion provided on the smooth portion to correspond to the conductive portion. The protrusion comes into contact with the contact surface and includes a concave-convex surface complementary to the concave-convex shape of the contact surface. The contact surface is positioned on a side of the top surface with respect to the main surface and a unit length of the contact surface is larger than a unit length of the top surface.

First claim

Opening claim text (preview).

The invention claimed is: 1. A wiring body comprising: a conductive portion including: a first surface having a concave-convex in a section view in a longitudinal direction of a body of the conductive portion, wherein the first surface includes a concave portion and a convex portion; a second surface facing the first surface, and conductive particles dispersed within the conductive portion; and a resin layer formed by being stacked on the first surface, wherein the resin layer includes: a smooth portion provided at a substantially constant thickness and having a substantially smooth main surface; and a protrusion provided on the smooth portion to correspond to the conductive portion and protruding from the main surface toward a side of the conductive portion, the protrusion comes into contact with the first surface and includes a concave-convex surface complementary to the concave-convex shape of the first surface, the first surface is positioned on a side of the second surface with respect to the main surface, and the following Formula (1) is satisfied: L 1 >L 2   (1) in the Formula (1), L 1 denotes a unit length of the first surface in the section view in the longitudinal direction of the body of the conductive portion, and L 2 denotes a unit length of the second surface in the section view in the longitudinal direction of the body of the conductive portion. 2. The wiring body according to claim 1 , wherein the following Formula (2) is satisfied: S 2 >S 1 ≥0.5S 2   (2) in the Formula (2), S 1 denotes an average gap between the first surface and the second surface in the concave portion, and S 2 denotes an average gap between the first surface and the second surface in the convex portion. 3. The wiring body according to claim 1 , wherein the first surface includes a waveform in which the concave portion and the convex portion are alternately continued, and the following Formula (3) is satisfied: 100D 1 ≥S 3 ≥3D 1   (3) in the Formula (3), S 3 denotes an average gap between adjacent convex portions, and D 1 denotes an average particle diameter of the conductive particles. 4. The wiring body according to claim 1 , wherein the following Formula (4) is satisfied: S 4 ≥3D 2   (4) in the Formula (4), S 4 denotes an average gap between the first surface and the second surface in the concave portion, and D 2 denotes an average particle diameter of the conductive particles. 5. The wiring body according to claim 1 , wherein an external shape of the conductive portion in a cross section in a short direction includes two straight line-shaped side surfaces inclined such that the side surfaces approach each other as being separated from the first surface. 6. A wiring board comprising: the wiring body according to claim 1 ; and a support that supports the wiring body. 7. A touch senor comprising the wiring board according to claim 6 . 8. The wiring body according to claim 1 , wherein the following Formula (5) is satisfied: S 5 ≥3D 3   (5) in the Formula (5), S 5 denotes an average height difference between the concave portion and the convex portion, and D 3 denotes an average particle diameter of the conductive particles.

Assignees

Inventors

Classifications

  • Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

  • H05K3/207Primary

    using a prefabricated paste pattern, ink pattern or powder pattern · CPC title

  • Mesh conductors, e.g. as a ground plane · CPC title

  • Locally raised area or protrusion of insulating substrate · CPC title

  • G06F3/044Primary

    by capacitive means · CPC title

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Frequently asked questions

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What does patent US10101865B2 cover?
A wiring body includes a conductive portion that includes a contact surface having a concave-convex shape, and an adhesive layer stacked on the contact surface. The conductive portion further includes a top surface facing the contact surface that contains conductive particles. The adhesive layer includes a smooth portion with a smooth main surface provided at a constant thickness, and a protrus…
Who is the assignee on this patent?
Fujikura Ltd
What technology area does this patent fall under?
Primary CPC classification H05K3/207. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).