Stretchable and foldable electronic devices

Patent metadata

Field	Value
Publication number	US-10064269-B2
Application number	US-201414521319-A
Country	US
Kind code	B2
Filing date	Oct 22, 2014
Priority date	Mar 5, 2008
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

First claim

We claim:

1. A method of making a stretchable and foldable electronic device, said method comprising:
coating a receiving substrate having a first Young's modulus with an isolation layer having a second Young's modulus, said isolation layer having a receiving surface, wherein said second Young's modulus is less than said first Young's modulus;
at least partially supporting an electronic device on said isolation layer receiving surface;
encapsulating at least a portion of said electronic device in an encapsulation layer; and
wherein said isolation layer isolates at least a portion of said electronic device from an applied strain.

2. The method of claim 1 , wherein said receiving substrate comprises a material selected from the group consisting of a polymer, an elastomer, a ceramic a metal, glass, a semiconductor, an inorganic polymer, and an organic polymer.

3. The method of claim 1 , wherein said receiving substrate comprises a material selected from the group consisting of fabric, vinyl, latex, spandex, leather and paper.

4. The method of claim 1 wherein said isolation layer provides at least a 20% or greater strain isolation compared to a device without said strain isolation layer.

5. The method of claim 1 , wherein the ratio of said first Young's modulus to said second Young's modulus is greater than or equal to 10.

6. The method of claim 1 , wherein said electronic device comprises a component of an electronic device, wherein said component comprises a plurality of interconnects.

7. The method of claim 6 , wherein at least a portion of said interconnects have a curved geometry.

8. The method of claim 1 , wherein said isolation layer comprises a polymer and said polymer at least partially penetrates said receiving substrate.

9. The method of claim 8 wherein the receiving substrate comprises fibers, wherein at least a portion of the fibers are embedded in said isolation layer.

10. The method of claim 1 , wherein said receiving substrate has a surface texture to increase contact area between said isolation layer and said receiving substrate.

11. The method of claim 1 , wherein said encapsulation layer has a Young's modulus that is less than or equal to said second Young's modulus.

12. The method of claim 11 wherein said encapsulation layer has an inhomogeneous Young's modulus.

13. A stretchable and foldable electronic device comprising:
a receiving substrate;
an isolation layer that at least partially coats one surface of said receiving substrate, said isolation layer having a Young's modulus less than or equal to said receiving substrate Young's modulus;
an electronic device that is at least partially supported by said isolation layer;
wherein said isolation layer is capable of providing at least 20% or greater strain isolation when said device is stretched or folded compared to a device without said isolation layer; and
an encapsulation layer that at least partially encapsulates said electronic device.

14. The device of claim 13 , wherein said electronic device comprises bond regions that are bonded to said isolation layer.

15. The device of claim 13 , wherein said electronic device comprises non-bond regions that connect adjacent bond regions, said non-bond regions comprising bent interconnects.

16. The device of claim 13 , wherein said encapsulation layer has a Young's modulus that is less than or equal to said isolation layer Young's modulus.

17. The device of claim 16 , wherein said encapsulation layer has an inhomogeneous Young's modulus.

18. A stretchable and foldable electronic device comprising:
a support layer, wherein said layer is elastomeric;
a functional layer supported by said support layer;
an one or more neutral mechanical surface adjusting layer; and
an encapsulation layer that at least partially encapsulates said functional layer;
wherein at least one or more of any of the layers has a property that is spatially inhomogeneous, thereby generating a neutral mechanical surface coincident or proximate to said functional layer.

19. The device of claim 18 , wherein said inhomogeneous layer property provides one or more flexible or elastic device region interspersed between a one or more mechanically rigid island regions.

20. The device of claim 18 , wherein the functional layer comprises an array of nanoribbons.

21. The device of claim 20 , wherein the nanoribbons are buckled and have a first end connected to a first rigid island region and a second end connected to a second rigid island region.

Assignees

• Univ Illinois
• Univ Northwestern

Inventors

• Rogers John A
• Huang Yonggang
• Ko Heung Cho
• Stoykovich Mark
• Choi Won Mook
• Song Jizhou
• Ahn Jong Hyun
• Kim Dae Hyeong

Classifications

• H10P72/743

  used as a support during manufacture of interconnect decals or build up layers · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title