Flexible substrate embedded with wires and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-9707706-B2
Application number	US-201514627913-A
Country	US
Kind code	B2
Filing date	Feb 20, 2015
Priority date	Feb 25, 2014
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern” where the only change is the addition of wires.

First claim

What is claimed is:

1. A flexible substrate embedded with wires, comprising:
a flexible substrate constituted by a polymer material; and
a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores.

2. The flexible substrate embedded with wires as claimed in claim 1 , wherein the polymer material comprises polyimide (PI) or polyvinylidene fluoride (PVDF).

3. The flexible substrate embedded with wires as claimed in claim 1 , wherein the wire pattern comprises silver, copper, nickel or an alloy thereof.

4. The flexible substrate embedded with wires as claimed in claim 1 , wherein the wire pattern has a resistivity ranging from 1.6×10 −6 Ω·cm to 10×10 −6 Ω·cm.

5. The flexible substrate embedded with wires as claimed in claim 1 , wherein the pore has a size ranging from 10 nm to 100 μm.

6. The flexible substrate embedded with wires as claimed in claim 1 , wherein the continuous wire pattern is embedded in an area inside the flexible substrate.

7. The flexible substrate embedded with wires as claimed in claim 1 , wherein the continuous wire pattern is embedded in an area near a surface of the flexible substrate.

8. A method for fabricating a flexible substrate embedded with wires, comprising:
providing a carrier;
forming a continuous wire pattern on the carrier, wherein the continuous wire pattern contains a plurality of pores;
covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and
separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern.

9. The method for fabricating a flexible substrate embedded with wires as claimed in claim 8 , wherein the carrier comprises glass or metal.

10. The method for fabricating a flexible substrate embedded with wires as claimed in claim 8 , further comprising performing a surface treatment process on the flexible substrate embedded with the continuous wire pattern.

11. The method for fabricating a flexible substrate embedded with wires as claimed in claim 8 , wherein the step of forming a continuous wire pattern on the carrier comprises:
providing a metal glue with a solid content ranging from 80% to 85%;
forming a continuous pattern of the metal glue on the carrier; and
performing a sintering process on the carrier, wherein the sintering process has a sintering temperature ranging from 300° C. to 350° C. and a sintering time ranging from 30 min to 40 min.

12. The method for fabricating a flexible substrate embedded with wires as claimed in claim 8 , wherein the step of covering a polymer material over the continuous wire pattern and the carrier comprises:
providing a polyvinylidene fluoride (PVDF) with a solid content ranging from 5% to 30%;
forming a polyvinylidene fluoride (PVDF) layer on the continuous wire pattern and the carrier; and
performing a baking process on the carrier, wherein the baking process has a baking temperature ranging from 50° C. to 180° C. and a baking time ranging from 10 min to 30 min.

13. The method for fabricating a flexible substrate embedded with wires as claimed in claim 8 , wherein the step of covering a polymer material over the continuous wire pattern and the carrier comprises:
providing a polyimide (PI) with a solid content ranging from 5% to 40%;
forming a polyimide (PI) layer on the continuous wire pattern and the carrier; and
performing a baking process on the carrier, wherein the baking process has a baking temperature ranging from 50° C. to 210° C. and a baking time ranging from 30 min to 60 min.

Assignees

• Ind Tech Res Inst

Inventors

• Su Chun-Wei
• Leu Chyi-Ming
• Kuo Yu-Ju
• Lin Hong-Ching
• Lu Chun-An
• Chen Chiung-Hsiung

Classifications

• B29K2027/16

  PVDF, i.e. polyvinylidene fluoride · CPC title

• H05K2201/2072

  Anchoring, i.e. one structure gripping into another · CPC title

• H05K2203/1131

  Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity · CPC title

• H05K3/207 Primary

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title

• B29K2079/08

  PI, i.e. polyimides or derivatives thereof · CPC title