Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate

Patent metadata

Field	Value
Publication number	US-2017261852-A1
Application number	US-201515529869-A
Country	US
Kind code	A1
Filing date	Nov 25, 2015
Priority date	Nov 26, 2014
Publication date	Sep 14, 2017
Grant date	—

Abstract

A photosensitive resin composition comprises: a resin having a phenolic hydroxyl group; a photosensitive acid generator; a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; and an aliphatic compound having two or more functional groups, the functional groups being at least one functional group selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group, wherein the photosensitive acid generator is a sulfonium salt containing an anion having at least one skeleton selected from the group consisting of a tetraphenylborate skeleton, an alkylsulfonate skeleton having 1 to 20 carbon atoms, a phenylsulfonate skeleton and a 10-camphorsulfonate skeleton.

First claim

1 . A photosensitive resin composition comprising:
a component (A): a resin having a phenolic hydroxyl group; a component (B): a photosensitive acid generator; a component (C): a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; and a component (D): an aliphatic compound having two or more functional groups, the functional groups being at least one functional group selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group, wherein the component (B) is a sulfonium salt containing an anion having at least one skeleton selected from the group consisting of a tetraphenylborate skeleton, an alkylsulfonate skeleton having 1 to 20 carbon atoms, a phenylsulfonate skeleton and a 10-camphorsulfonate skeleton.

2 . The photosensitive resin composition according to claim 1 , wherein the anion of the component (B) is at least one selected from the group consisting of tetrakis(pentafluorophenyl)borate, trifluoromethanesulfonate, nonafluorobutanesulfonate, p-toluenesulfonate and 10-camphorsulfonate.

3 . The photosensitive resin composition according to claim 1 , wherein a content of the component (D) is 1 to 70 parts by mass with respect to 100 parts by mass of the component (A).

4 . The photosensitive resin composition according to claim 1 , further comprising a compound having a Si—O bond.

5 . A photosensitive element comprising:
a support; and a photosensitive layer provided on the support, wherein the photosensitive layer comprises the photosensitive resin composition according to claim 1 .

6 . A cured product of the photosensitive resin composition according to claim 1 .

7 . A semiconductor device comprising the cured product of the photosensitive resin composition according to claim 6 .

8 . A method for forming a resist pattern, comprising:
a step of forming a photosensitive layer comprising the photosensitive resin composition according to claim 1 on a substrate; an exposing step of exposing the photosensitive layer in order to form a predetermined pattern; a developing step of developing the photosensitive layer after the exposing step to obtain a resin pattern; and a heat-treating step of heat-treating the resin pattern.

9 . A method for forming a resist pattern, comprising:
a step of disposing the photosensitive layer of the photosensitive element according to claim 5 on a substrate; an exposing step of exposing the photosensitive layer in order to form a predetermined pattern; a developing step of developing the photosensitive layer after the exposing step to obtain a resin pattern; and a heat-treating step of heat-treating the resin pattern.

10 . The method for forming a resist pattern according to claim 8 , further comprising a step of heat-treating the photosensitive layer between the exposing step and the developing step.

11 . A method for producing a circuit substrate, comprising:
a conductor layer forming step of subjecting at least a part of an exposed part of the resin pattern after the heat-treating step in the method for forming a resist pattern according to claim 8 and at least a part of an exposed part of the substrate to a plating treatment, to form a conductor layer; and a conductor pattern forming step of removing a part of the conductor layer to form a conductor pattern, wherein the circuit substrate includes a resin pattern and a conductor pattern.

12 . The method for producing a circuit substrate according to claim 11 , wherein the conductor layer forming step includes a step of performing electrolytic plating after performing electroless plating, to form the conductor layer.

13 . The method for producing a circuit substrate according to claim 11 , wherein the conductor layer forming step includes a step of performing electrolytic plating after performing sputtering, to form the conductor layer.

14 . The method for producing a circuit substrate according to claim 11 , wherein the conductor pattern forming step includes a step of removing a part of the conductor layer by etching, to form the conductor pattern.

15 . The method for producing a circuit substrate according to claim 11 , wherein the conductor pattern forming step includes a step of removing a part of the conductor layer by polishing, to form the conductor pattern.

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Kato Tetsuya
• Iwashita Kenichi
• Nakamura Akihiro
• Nakano Akio
• Ono Hiroshi

Classifications

• H05K3/0023

  by exposure and development of a photosensitive insulating layer · CPC title

• H05K3/007

  Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence) · CPC title

• H05K3/4602

  characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H05K3/188

  by direct electroplating · CPC title