Method for forming high-definition metal pattern, high-definition metal pattern, and electronic component

Patent metadata

Field	Value
Publication number	US-9629253-B2
Application number	US-201414441605-A
Country	US
Kind code	B2
Filing date	Mar 6, 2014
Priority date	Mar 12, 2013
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.

First claim

The invention claimed is:

1. A method for forming a high-definition metal pattern, the method comprising the steps of:
(1) forming a receiving layer on a substrate by coating the substrate with a resin composition, the resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin, and a medium;
wherein the urethane resin includes an alicyclic structure and a hydrophilic group, the content of the alicyclic structure being 2000 to 5500 mmol/kg relative to the total amount of the urethane resin, and
wherein the vinyl resin is produced by polymerizing a vinyl monomer mixture of 10% to 70% by mass of methyl methacrylate and 10% to 50% by mass of a (meth)acrylic acid alkyl ester including an alkyl group having 2 to 12 carbon atoms,
(2) forming a plating-core pattern on the receiving layer by printing an ink on the receiving layer by reverse offset printing, the ink including a particle that serves as a plating core; and
(3) depositing a metal on the plating-core pattern formed in the step (2) by electroless plating.

2. The method for forming a high-definition metal pattern according to claim 1 , wherein the particle that serves as a plating core is a metal nanoparticle having a mean volume diameter (Mv) of 2 to 100 nm, the metal nanoparticle being protected using an organic compound including a basic nitrogen atom and being dispersed in the ink.

3. The method for forming a high-definition metal pattern according to claim 2 , wherein the urethane resin or the vinyl resin included in the resin composition includes a functional group capable of crosslinking with the organic compound including a basic nitrogen atom, the organic compound being used for protecting the metal nanoparticle.

4. The method for forming a high-definition metal pattern according to claim 1 , wherein the ink further includes a fluorine-based surface-energy modifier and/or a silicone-based surface-energy modifier.

5. The method for forming a high-definition metal pattern according to claim 1 , wherein the reverse offset printing includes the steps of:
(i) forming a uniform ink film on a liquid-repellent surface of a blanket;
(ii) pressing a relief printing plate against the ink film to remove part of the ink which is brought into contact with the relief printing plate from the blanket; and
(iii) transferring the ink remaining on the blanket to a printing object to form a desired pattern.

6. The method for forming a high-definition metal pattern, the method comprising the steps of:
(1) forming a receiving layer on a substrate by coating the substrate with a resin composition, the resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin, and a medium,
wherein the resin composition includes a composite resin particle constituted by a shell layer including the urethane resin and by a core layer including the vinyl resin;
(2) forming a plating-core pattern on the receiving layer by printing an ink on the receiving layer by reverse offset printing, the ink including a particle that serves as a plating core; and
(3) depositing a metal on the plating-core pattern formed in the step (2) by electroless plating.

7. The method for forming a high-definition metal pattern according to claim 6 ,
wherein the urethane resin includes an alicyclic structure and a hydrophilic group, the content of the alicyclic structure being 2000 to 5500 mmol/kg relative to the total amount of the urethane resin.

8. The method for forming a high-definition metal pattern according to claim 7 , wherein the particle that serves as a plating core is a metal nanoparticle having a mean volume diameter (Mv) of 2 to 100 nm, the metal nanoparticle being protected using an organic compound including a basic nitrogen atom and being dispersed in the ink.

9. The method for forming a high-definition metal pattern according to claim 7 , wherein the ink further includes a fluorine-based surface-energy modifier and/or a silicone-based surface-energy modifier.

10. The method for forming a high-definition metal pattern according to claim 6 ,
wherein the vinyl resin is produced by polymerizing a vinyl monomer mixture of 10% to 70% by mass of methyl methacrylate and 10% to 50% by mass of a (meth)acrylic acid alkyl ester including an alkyl group having 2 to 12 carbon atoms.

11. The method for forming a high-definition metal pattern according to claim 10 , wherein the particle that serves as a plating core is a metal nanoparticle having a mean volume diameter (Mv) of 2 to 100 nm, the metal nanoparticle being protected using an organic compound including a basic nitrogen atom and being dispersed in the ink.

12. The method for forming a high-definition metal pattern according to claim 10 , wherein the ink further includes a fluorine-based surface-energy modifier and/or a silicone-based surface-energy modifier.

13. The method for forming a high-definition metal pattern according to claim 6 , wherein the particle that serves as a plating core is a metal nanoparticle having a mean volume diameter (Mv) of 2 to 100 nm, the metal nanoparticle being protected using an organic compound including a basic nitrogen atom and being dispersed in the ink.

14. The method for forming a high-definition metal pattern according to claim 6 , wherein the ink further includes a fluorine-based surface-energy modifier and/or a silicone-based surface-energy modifier.

15. The method for forming a high-definition metal pattern according to claim 6 , wherein the reverse offset printing includes the steps of:
(i) forming a uniform ink film on a liquid-repellent surface of a blanket;
(ii) pressing a relief printing plate against the ink film to remove part of the ink which is brought into contact with the relief printing plate from the blanket; and
(iii) transferring the ink remaining on the blanket to a printing object to form a desired pattern.

16. The method for forming a high-definition metal pattern according to claim 7 , wherein the reverse offset printing includes the steps of:
(i) forming a uniform ink film on a liquid-repellent surface of a blanket;
(ii) pressing a relief printing plate against the ink film to remove part of the ink which is brought into contact with the relief printing plate from the blanket; and
(iii) transferring the ink remaining on the blanket to a printing object to form a desired pattern.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Yoshihara Sunao
• Katsuta Haruhiko
• Katayama Yoshinori
• Shirakami Jun
• Murakawa Akira
• Fujikawa Wataru
• Saitou Yukie

Classifications

• H05K2203/097

  Corona discharge · CPC title

• H05K2203/0709

  Catalytic ink or adhesive for electroless plating · CPC title

• H05K2203/0108

  Male die used for patterning, punching or transferring · CPC title

• H05K3/207

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title

• H05K3/182 Primary

  characterised by the patterning method · CPC title