Method for manufacturing laminate containing patterned layers to be plated, method for manufacturing metal layer-containing laminate, touch panel sensor, touch panel, laminate containing patterned layers to be plated, and metal layer-containing laminate

US2017160837A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017160837-A1
Application numberUS-201715433430-A
CountryUS
Kind codeA1
Filing dateFeb 15, 2017
Priority dateSep 22, 2014
Publication dateJun 8, 2017
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A method for manufacturing a laminate containing patterned layers to be plated includes a step of preparing a laminate having a substrate having two main surfaces, and layers for forming a layer to be plated, respectively disposed on two main surfaces of the substrate and containing a polymerization initiator, a step of irradiating a layer for forming a layer to be plated in the laminate with light in a patternwise fashion under a predetermined requirement, and a step of removing non-light irradiated regions in the layers for forming a layer to be plated, thereby forming patterned layers to be plated on two main surfaces of the substrate. Also set forth are a touch panel sensor, a touch panel, a laminate containing patterned layers to be plated, and a metal layer-containing laminate.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for manufacturing a laminate containing patterned layers to be plated, comprising: a step A of preparing a laminate having a substrate having two main surfaces, and layers for forming a layer to be plated, respectively disposed on two main surfaces of the substrate and containing a polymerization initiator and the following compound X or composition Y; a step B including a step B-1 of irradiating one layer for forming a layer to be plated with light in a patternwise fashion from one main surface side of the substrate in the laminate, so as to satisfy the following requirement 1 or requirement 2, and a step B-2 of irradiating the other layer for forming a layer to be plated with light in a patternwise fashion from the other main surface of the substrate, so as to satisfy the following requirement 1 or requirement 2; and a step C of removing non-light irradiated regions in the layers for forming a layer to be plated to form patterned layers to be plated on two main surfaces of the substrate, respectively, Compound X: a compound having a functional group capable of interacting with a plating catalyst or a precursor thereof, and a polymerizable group, Composition Y: a composition containing a compound having a functional group capable of interacting with a plating catalyst or a precursor thereof, and a compound having a polymerizable group, Requirement 1: in a case where an absorption edge on the long wavelength side of an ultraviolet-visible absorption spectrum of the polymerization initiator is present in the shorter wavelength side than the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the substrate, the layer for forming a layer to be plated is irradiated in a patternwise fashion with light of a wavelength to which the polymerization initiator is exposed, and Requirement 2: in a case where the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the polymerization initiator is present in the longer wavelength side than the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the substrate, the layer for forming a layer to be plated is irradiated in a patternwise fashion with light of a wavelength to which a polymerization initiator is exposed, as light excluding light of a wavelength longer than or equal to a wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the substrate and shorter than or equal to a wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the polymerization initiator. 2 . The method for manufacturing a laminate containing patterned layers to be plated according to claim 1 , wherein, in the requirement 2, light irradiation is carried out using a light-blocking filter at least blocking the light having a wavelength longer than or equal to a wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the substrate and shorter than or equal to a wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the polymerization initiator. 3 . The method for manufacturing a laminate containing patterned layers to be plated according to claim 1 , wherein the substrate is a resin substrate. 4 . The method for manufacturing a laminate containing patterned layers to be plated according to claim 1 , wherein an ultraviolet absorber is included in the substrate. 5 . The method for manufacturing a laminate containing patterned layers to be plated according to claim 1 , wherein the substrate is a laminate having a support and an ultraviolet absorbing layer containing an ultraviolet absorber disposed on the support. 6 . A method for manufacturing a metal layer-containing laminate, comprising a step of applying a plating catalyst or a precursor thereof onto the patterned layer to be plated in the laminate containing patterned layers to be plated obtained from the manufacturing method according to claim 1 , carrying out a plating treatment on the patterned layer to be plated onto which the plating catalyst or the precursor thereof was applied, and then forming a metal layer on the patterned layer to be plated. 7 . A touch panel sensor comprising a metal layer-containing laminate obtained from the manufacturing method according to claim 6 . 8 . A touch panel comprising a metal layer-containing laminate obtained from the manufacturing method according to claim 6 . 9 . A laminate containing patterned layers to be plated, comprising: a substrate having two main surfaces; and patterned layers to be plated, respectively disposed on two main surfaces of the substrate and used for a plating catalyst or a precursor thereof to be supported, wherein patterns of the patterned layers to be plated respectively disposed on two main surfaces of the substrate are different. 10 . A metal layer-containing laminate, comprising: the laminate containing patterned layers to be plated according to claim 9 ; and a metal layer disposed on a surface other than the contact surface with the substrate of the patterned layer to be plated in the laminate containing patterned layers to be plated. 11 . The method for manufacturing a laminate containing patterned layers to be plated according to claim 2 , wherein the substrate is a resin substrate. 12 . The method for manufacturing a laminate containing patterned layers to be plated according to claim 2 , wherein an ultraviolet absorber is included in the substrate. 13 . The method for manufacturing a laminate containing patterned layers to be plated according to claim 3 , wherein an ultraviolet absorber is included in the substrate. 14 . The method for manufacturing a laminate containing patterned layers to be plated according to claim 2 , wherein the substrate is a laminate having a support and an ultraviolet absorbing layer containing an ultraviolet absorber disposed on the support. 15 . The method for manufacturing a laminate containing patterned layers to be plated according to claim 3 , wherein the substrate is a laminate having a support and an ultraviolet absorbing layer containing an ultraviolet absorber disposed on the support. 16 . The method for manufacturing a laminate containing patterned layers to be plated according to claim 4 , wherein the substrate is a laminate having a support and an ultraviolet absorbing layer containing an ultraviolet absorber disposed on the support. 17 . A method for manufacturing a metal layer-containing laminate, comprising a step of applying a plating catalyst or a precursor thereof onto the patterned layer to be plated in the laminate containing patterned layers to be plated obtained from the manufacturing method according to claim 2 , carrying out a plating treatment on the patterned layer to be plated onto which the plating catalyst or the precursor thereof was applied, and then forming a metal layer on the patterned layer to be plated. 18 . A method for manufacturing a metal layer-containing laminate, comprising a step of applying a plating catalyst or a precursor thereof onto the patterned layer to be plated in the laminate containing patterned layers to be plated obtained from the manufacturing method according to claim 3 , carrying out a plating treatment on the patterned layer to be plated onto which the plating catalyst or the precursor thereof was applied, and then forming a metal

Assignees

Inventors

Classifications

  • Electroplating characterised by the article coated · CPC title

  • G06F3/044Primary

    by capacitive means · CPC title

  • Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

  • using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer · CPC title

  • using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50 · CPC title

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What does patent US2017160837A1 cover?
A method for manufacturing a laminate containing patterned layers to be plated includes a step of preparing a laminate having a substrate having two main surfaces, and layers for forming a layer to be plated, respectively disposed on two main surfaces of the substrate and containing a polymerization initiator, a step of irradiating a layer for forming a layer to be plated in the laminate with l…
Who is the assignee on this patent?
Fujifilm Corp
What technology area does this patent fall under?
Primary CPC classification G06F3/044. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Jun 08 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).