Metalized plastic articles and methods thereof

Patent metadata

Field	Value
Publication number	US-9770887-B2
Application number	US-201414462293-A
Country	US
Kind code	B2
Filing date	Aug 18, 2014
Priority date	Aug 19, 2010
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe 2 O 4−δ , Ca 0.25 Cu 0.75 TiO 3−β , and TiO 2−σ , wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

First claim

What is claimed is:

1. A method of metalizing a plastic substrate comprising:
providing a plastic substrate having accelerators dispersed in the plastic substrate, the accelerators having a formula of Ca 0.25 Cu 0.75 TiO 3−β , wherein β denotes oxygen vacancies in corresponding accelerators and 0.05≦β≦0.5;
removing, by laser, at least a portion of a surface of the plastic substrate to expose the accelerators, wherein the power of the laser is less than the power to reduce the accelerators to pure metals; and
plating the exposed surface of the plastic substrate to form at least a first metal layer.

2. The method of claim 1 , wherein the laser has a wave length of about 10.6 microns.

3. The method of claim 1 , wherein the laser has a power ranging from about 3 watts to about 4 watts.

4. The method of claim 1 , wherein the accelerators include accelerators with a formula of Ca 0.25 Cu 0.75 TiO 2.84 .

5. The method of claim 1 , wherein the accelerators include accelerators with a formula of Ca 0.25 Cu 0.75 TiO 2.5 .

6. The method of claim 1 , wherein the plastic substrate further comprises at least one additive selected from the group consisting of: an antioxidant, a light stabilizer, a lubricant, and inorganic fillers.

7. The method of claim 1 , wherein providing a plastic substrate having accelerators dispersed in the plastic substrate comprises:
calcining Ca 0.25 Cu 0.75 TiO 3 powder to obtain accelerators having a formula of Ca 0.25 Cu 0.75 TiO 3−β , wherein β denotes oxygen vacancies in corresponding accelerators and 0.05≦β≦0.5; and
dispersing the accelerators in a plastic material and molding the plastic material to form the plastic substrate.

8. The method of claim 1 , wherein providing a plastic substrate having accelerators dispersed in the plastic substrate comprises:
mixing CaCO 3 , CuO, and TiO 2 ;
heating the mixture to form Ca 0.25 Cu 0.75 TiO 3 powder;
calcining the Ca 0.25 Cu 0.75 TiO 3 powder to obtain accelerators having a formula of Ca 0.25 Cu 0.75 TiO 3−β , wherein β denotes oxygen vacancies in corresponding accelerators and 0.05≦β≦0.5; and
dispersing the accelerators in a plastic material and molding the plastic material to form the plastic substrate.

9. The method of claim 1 , wherein the accelerators have an average diameter of 500 nanometers.

10. A method of metalizing a plastic substrate comprising:
providing a plastic substrate having accelerators dispersed in the plastic substrate, the accelerators having a formula selected from the group of: CuFe 2 O 4−δ , Ca 0.25 Cu 0.75 TiO 3−β , and TiO 2−σ ,wherein δ, β,σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0;
removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator, wherein the power used to remove the portion of the surface of the plastic substrate is less than the power to reduce the accelerators to pure metals; and
plating the exposed surface of the plastic substrate to form at least a first metal layer.

11. The method of claim 10 , wherein removing at least a portion of a surface of the plastic substrate includes removing, by a laser, at least a portion of a surface of the plastic substrate, and the laser has a wave length of about 10.6 microns.

12. e method of claim 11 , wherein the laser has a power ranging from about 3 watts to about 4 watts.

13. The method of claim 10 , wherein the plastic substrate further comprises at least one additive selected from the group consisting of: an antioxidant, a light stabilizer, a lubricant, and inorganic fillers.

Assignees

• Byd Co Ltd

Inventors

• Gong Qing
• Zhou Liang
• Miao Weifeng
• Zhang Xiong

Classifications

• C23C18/32

  Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title

• H05K2203/107

  Using laser light · CPC title

• H05K3/182

  characterised by the patterning method · CPC title

• C23C18/2013

  by mechanical pretreatment, e.g. grinding, sanding · CPC title

• C23C18/204

  Radiation, e.g. UV, laser · CPC title