Galvanic process for making printed conductive metal markings for chipless RFID applications

US9439293B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9439293-B2
Application numberUS-94377407-A
CountryUS
Kind codeB2
Filing dateNov 21, 2007
Priority dateNov 21, 2007
Publication dateSep 6, 2016
Grant dateSep 6, 2016

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A process for printing a metal wire pattern on a substrate, including: printing a first salt solution including a metal ion that will undergo a reduction half-reaction; printing a second salt solution containing a reductant that will undergo an oxidation half-reaction in contact with the first salt solution, resulting in the reduction of the metal ions of the first salt solution; and allowing the first and second salt solutions to react by a galvanic reaction, causing reduced metal ions of the first salt solution to precipitate as a solid, on the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for printing a conductive metal wire pattern on a substrate, comprising: printing a homogenous first salt solution comprising a first solvent and a first metal ion, the first metal ion selected from the group consisting of copper, aluminum, magnesium, manganese, zinc, chromium, lead, cadmium, cobalt, nickel, gold, silver, platinum, tin, iron, and mixtures thereof; printing a homogeneous second salt solution comprising a second solvent and a second metal ion configured to reduce the homogeneous first salt solution, the second metal ion selected from the group consisting of iron (II), lead (II), chromium (II), mercury (II), platinum (IV), palladium (IV), nickel (III), and cobalt (III); and forming a metal wire pattern by the galvanic reaction on the substrate of the printed homogeneous first and the homogeneous second salt solutions to precipitate the first metal ion as solid metal nanoparticles having a size of about 5 nm to about 7 nm on the substrate; wherein: additional energy is not required to anneal the metal nanoparticles together and create the conductive metal wire pattern; the second metal ion has a lower reduction potential than the first metal ion; the first and/or second salt solutions are printed directly onto the substrate; the substrate is selected from the group consisting of paper, glass art paper, bond paper, paperboard, Kraft paper, cardboard, semi-synthetic paper, and plastic sheets; the printing of the first salt solution and the second salt solution is performed using a heated printer that deposits the first salt solution and the second salt solution onto the substrate in a flowable state; and after mixing and reacting, the first solvent of the first salt solution and the second solvent of the second salt solution evaporate to form the metal wire pattern by depositing the reduced first metal ion nanoparticle on the substrate. 2. The method according to claim 1 , wherein the first metal ion in the homogenous first salt solution is copper (II). 3. The method according to claim 1 , wherein the second metal ion is not an elemental metal. 4. The method according to claim 1 , wherein the second metal ion is chromium (II). 5. The method according to claim 1 , wherein the homogeneous first salt solution and the homogenous second salt solution are printed via a printing method selected from the group consisting of inkjet, screen printing, gravure, rotogravure, and flexography. 6. The method according to claim 5 , wherein the homogeneous first salt solution and the homogeneous second salt solution are printed by an inkjet printer. 7. The method according to claim 6 , wherein: the homogeneous first salt solution contains copper (II) as the first metal ion; and the second salt solution contains chromium (II) as the second metal ion. 8. The method according to claim 5 , wherein the two homogenous salt solutions are printed in a manner such that one salt solution fully overlaps the other solution. 9. The method according to claim 5 , wherein the two homogeneous salt solutions are printed in a manner such that the two salt solutions only partially overlap. 10. The method according to claim 5 , wherein the two homogeneous salt solutions are printed via a two-pass process, whereby the inkjet printer prints one homogeneous salt solution during the first pass over the substrate, and then prints the other homogeneous salt solution during a subsequent second pass over the substrate. 11. The method according to claim 5 , wherein the two homogeneous salt solutions are printed during a single pass of the inkjet printer over the substrate. 12. A method of printing resonant antennae in chipless RFID applications, comprising the method of claim 1 . 13. The method according to claim 1 , wherein the second metal ion is lead (II). 14. The method according to claim 1 , wherein the second ionic metal species in the homogeneous second salt solution is provided in the form of a metal salt selected from the group consisting of metal sulfates, metal halides, metal acetates, metal oxides, metal carbonates, metal hydroxides, metal oxalates, metal pyrazolyl borates, metal azides, metal fluoroborates, metal carboxylates, metal halogencarboxylates, metal hydroxycarboxylates, metal aminocarboxylates, metal aromatics, which may optionally be nitro and/or fluoro substituted aromatic carboxylates, metal beta diketonates, and metal sulfonates. 15. The method of claim 1 , wherein at least one of the first solvent and the second solvent has a melting point of at least 30° C. and less than or equal to 100° C. 16. A method of printing a conductive metal wire on a substrate, comprising: depositing a first ionic metal solution comprising a first solvent and an oxidizing first metal ion directly onto a substrate, the first metal ion selected from the group consisting of copper, aluminum, magnesium, manganese, zinc, chromium, lead, cadmium, cobalt, nickel, gold, silver, platinum, tin, iron, and mixtures thereof; and depositing a second ionic metal solution comprising a second solvent and a reducing second metal ion directly onto the substrate, the second metal ion selected from the group consisting of iron (II), lead (II), chromium (II), mercury (II), platinum (IV), palladium (IV), nickel (III), and cobalt (III), the second ionic metal solution configured to reduce the first ionic metal solution; and forming a metal wire on the substrate by the galvanic reaction on the substrate of the deposited first and second ionic solutions to precipitate a reduced solid metal form of the first metal ion on the substrate, the solid metal form comprising metal nanoparticles having a size of about 5 nm to about 7 nm, wherein at least one of the first and second ionic solutions are deposited on the substrate in a flowable form using a heated printer head, wherein additional energy is not required to anneal the metal nanoparticles together and create the conductive metal wire, and wherein the reducing second metal ion has a lower reduction potential than the oxidizing first metal ion. 17. The method of printing a conductive metal wire on a substrate of claim 16 , wherein a width of the metal wire is controlled by an overlap amount of the deposited first and second ionic solutions. 18. The method of printing a conductive metal wire on a substrate of claim 16 , wherein the first and second solvent mix upon deposition on the substrate and react under a galvanic reaction to precipitate the reduced first metal ion nanoparticle. 19. The method of printing a conductive metal wire on a substrate of claim 18 , further comprising: evaporating the first and second solvents from the substrate to deposit the metal wire comprising the reduced first metal ion nanoparticle. 20. The method of printing a conductive metal wire on a substrate of claim 16 , wherein the conductive metal wire has a thickness of about 0.01 μm to about 5 μm and a print resistance of about 10 Ohms/square to about 10,000 Ohms/square.

Assignees

Inventors

Classifications

  • Inkjet printing, e.g. for printing insulating material or resist · CPC title

  • H05K3/125Primary

    by ink-jet printing · CPC title

  • {the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g.} from an outlet device in contact or almost in contact, with the work · CPC title

  • Using means for chemical reduction · CPC title

  • using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

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What does patent US9439293B2 cover?
A process for printing a metal wire pattern on a substrate, including: printing a first salt solution including a metal ion that will undergo a reduction half-reaction; printing a second salt solution containing a reductant that will undergo an oxidation half-reaction in contact with the first salt solution, resulting in the reduction of the metal ions of the first salt solution; and allowing t…
Who is the assignee on this patent?
Chopra Naveen, Kazmaier Peter M, Lalisse Dominique J, and 2 more
What technology area does this patent fall under?
Primary CPC classification H05K3/125. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).