Fabrication of Electronic Products Using Flexible Substrates
US-2018348634-A1 · Dec 6, 2018 · US
Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38)
Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/1208 |
| Official title | {Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38)} |
| Display label | Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38) |
| Total patents | 144 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 17 |
| 2016 | 16 |
| 2017 | 15 |
| 2018 | 16 |
| 2019 | 14 |
| 2020 | 13 |
| 2021 | 10 |
| 2022 | 11 |
| 2023 | 13 |
| 2024 | 16 |
| 2025 | 2 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Capacitive devices and methods of fabricating same
US-2018314359-A1 · Nov 1, 2018 · US
UV curable interlayer composition for printed electronics application
US-10113082-B2 · Oct 30, 2018 · US
Nanoparticle application with adhesives for printable electronics
US-2018270962-A1 · Sep 20, 2018 · US
Electrically conductive materials comprising graphene
US-2018242452-A1 · Aug 23, 2018 · US
Conductive pattern, electric circuit, electromagnetic wave shield, and method for producing conductive pattern
US-2018206368-A1 · Jul 19, 2018 · US
Method of printing ultranarrow line
US-2018187035-A1 · Jul 5, 2018 · US
Laminated body, molded article, electroconductive pattern, electronic circuit, and electromagnetic shield
US-2018162106-A1 · Jun 14, 2018 · US
Electronic circuit and method of manufacturing the same
US-2018146548-A1 · May 24, 2018 · US
Articles and substrates providing improved performance of printable electronics
US-2018132350-A1 · May 10, 2018 · US
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US-9967976-B2 · May 8, 2018 · US
Uv curable interlayer composition for printed electronics application
US-2018079926-A1 · Mar 22, 2018 · US
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US-2017347459-A1 · Nov 30, 2017 · US
Resin film, coverlay for printed wiring board, substrate for printed wiring board, and printed wiring board
US-2017327630-A1 · Nov 16, 2017 · US
Wiring board and method for manufacturing the same
US-2017325335-A1 · Nov 9, 2017 · US
Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic device
US-9746775-B2 · Aug 29, 2017 · US
Method of forming pattern and pattern
US-9738807-B2 · Aug 22, 2017 · US
Surface treatment of hydrophobic ferroelectric polymers for printing
US-2017237003-A1 · Aug 17, 2017 · US
Film-like printed circuit board, and method for producing the same
US-2017223827-A1 · Aug 3, 2017 · US
Cellulose and Cellulosic Substrate-Based Device
US-2017181278-A1 · Jun 22, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/1208?
- CPC H05K3/1208 is the Cooperative Patent Classification code for “Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38).”
- How many patents are filed under CPC H05K3/1208 (Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38))?
- Our database includes 144 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/1208 growing?
- Publication counts under this code: 16 in 2024 vs 2 in 2025 (latest complete years).