Pattern formed body
US-2017261857-A1 · Sep 14, 2017 · US
Wiring board and method for manufacturing the same
US2017325335A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017325335-A1 |
| Application number | US-201515523764-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 11, 2015 |
| Priority date | Nov 21, 2014 |
| Publication date | Nov 9, 2017 |
| Grant date | — |
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- Title
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Abstract
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A wiring board and a method for manufacturing the same enabling simple and easy formation of a conductive pattern are provided. The method comprises a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a higher surface free energy than the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing to obtain a base material to which the surface free energy difference pattern is transferred; and a conductive pattern forming step of applying a conductive coating composition onto a surface of pattern transfer of the base material to form a conductive pattern.
First claim
Opening claim text (preview).
1 . A method for manufacturing a wiring board comprising: a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a high surface free energy which is higher than the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing to obtain a base material to which the surface free energy difference pattern is transferred; and a conductive pattern forming step of applying a conductive coating composition onto a surface of pattern transfer of the base material to form a conductive pattern. 2 . The method for manufacturing a wiring board according to claim 1 , wherein the base material has a pattern of a high surface free energy region and a low surface free energy region, wherein the high surface free energy region has a surface free energy of 20 to 60 mJ/cm 2 , and wherein the low surface free energy region has a surface free energy of 10 to 25 mJ/cm 2 . 3 . The method for manufacturing a wiring board according to claim 1 , wherein the conductive coating composition contains silver. 4 . The method for manufacturing a wiring board according to claim 1 , wherein the first compound is a perfluoropolyether derivative. 5 . The method for manufacturing a wiring board according to claim 1 , wherein the resin composition is a photocurable acrylic resin composition, and wherein the first compound is a perfluoropolyether group-containing (meth)acrylate. 6 . A wiring board comprising: a base material having a pattern of a high surface free energy region and a low surface free energy region; and a conductive pattern formed on the high surface free energy region. 7 . The wiring board according to claim 6 , wherein the conductive pattern is formed on the high surface free energy region, and wherein the low surface free energy region has a surface free energy of 10 to 25 mJ/cm 2 . 8 . The method for manufacturing a wiring board according to claim 2 , wherein the conductive coating composition contains silver. 9 . The method for manufacturing a wiring board according to claim 2 , wherein the first compound is a perfluoropolyether derivative. 10 . The method for manufacturing a wiring board according to claim 3 , wherein the first compound is a perfluoropolyether derivative. 11 . The method for manufacturing a wiring board according to claim 2 , wherein the resin composition is a photocurable acrylic resin composition, and wherein the first compound is a perfluoropolyether group-containing (meth)acrylate. 12 . The method for manufacturing a wiring board according to claim 3 , wherein the resin composition is a photocurable acrylic resin composition, and wherein the first compound is a perfluoropolyether group-containing (meth)acrylate.
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Classifications
containing O · CPC title
Differences in wettability, e.g. hydrophilic or hydrophobic areas · CPC title
Silicon containing polymer, e.g. silicone · CPC title
with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties · CPC title
containing halogen · CPC title
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Frequently asked questions
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- What does patent US2017325335A1 cover?
- A wiring board and a method for manufacturing the same enabling simple and easy formation of a conductive pattern are provided. The method comprises a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a higher surface free energy than the first compound into contact with a master on which a desired sur…
- Who is the assignee on this patent?
- Dexerials Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K3/1208. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Nov 09 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).