Method of forming pattern and pattern

Patent metadata

Field	Value
Publication number	US-9738807-B2
Application number	US-201514848114-A
Country	US
Kind code	B2
Filing date	Sep 8, 2015
Priority date	Oct 8, 2014
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

According to one embodiment, a method of forming a pattern includes preparing a substrate having a liquid-repellent face and a lyophilic pattern which are located adjacent to each other on a surface of the substrate, the lyophilic pattern having a surface energy different from the liquid-repellent face, bringing ink into contact with the substrate, and applying the ink to the lyophilic pattern by moving a contacted ink surface. The lyophilic pattern includes a linear main lyophilic pattern and an auxiliary lyophilic pattern connected to the lyophilic pattern. A liquid-repellent region is defined in the liquid-repellent face between the main lyophilic pattern and the auxiliary lyophilic pattern.

First claim

What is claimed is:

1. A method of forming a pattern comprising:
preparing a substrate having a liquid-repellent face and a lyophilic pattern which are located adjacent to each other on a surface of the substrate, the lyophilic pattern having a surface energy different from the liquid-repellent face;
retaining ink between an ink retention member and the surface of the substrate including the lyophilic pattern; and
moving the ink retention member relatively with respect to the substrate while the ink is kept in contact with the surface of the substrate, thereby applying the ink to the lyophilic pattern on the surface of the substrate,
wherein the lyophilic pattern comprises a linear main lyophilic pattern and an auxiliary lyophilic pattern connected to the main lyophilic pattern,
a liquid-repellent region is defined in the liquid-repellent face between the main lyophilic pattern and the auxiliary lyophilic pattern, and
the liquid-repellent region is closed by a portion connecting the main lyophilic pattern and the auxiliary lyophilic pattern on an upstream side for a move direction of the ink surface and is open on a downstream side from the portion.

2. The method of claim 1 , wherein a plurality of auxiliary lyophilic patterns are connected to the main lyophilic pattern along the main lyophilic pattern.

3. The method of claim 2 , wherein the plurality of auxiliary lyophilic patterns are connected to the main lyophilic pattern along the main lyophilic pattern in different pitches.

4. The method of claim 1 , wherein a plurality of auxiliary lyophilic patterns are connected to the main lyophilic pattern along the main lyophilic pattern, when an area of a main lyophilic pattern portion located between connection portions of two adjacent auxiliary lyophilic patterns in a longitudinal direction of the main lyophilic pattern is defined as S 1 , and an area of the liquid-repellent region defined in the liquid-repellent face between the main lyophilic pattern and each of the auxiliary lyophilic patterns on the upstream side for the move direction of the ink surface of the main lyophilic pattern portion is defined as S 2 , S 2 is greater than or equal to 0.02 times S 1 .

5. The method of claim 1 , wherein a plurality of main lyophilic patterns are provided parallel to each other, and the auxiliary lyophilic pattern is connected to each of the main lyophilic patterns.

6. The method of claim 5 , wherein in two adjacent main lyophilic patterns, the auxiliary lyophilic pattern connected to one of the two main lyophilic patterns is allocated so as to be out of alignment with the auxiliary lyophilic pattern connected to the other main lyophilic pattern along the main lyophilic patterns.

7. The method of claim 1 , further comprising another liquid-repellent region which is adjacent to the liquid-repellent region on an upstream side for the move direction of the ink surface and is open on the upstream side.

8. The method of claim 1 , wherein the ink is conductive ink in which metal nanoparticles are dispersed.

9. The method of claim 8 , wherein after a conductive ink pattern is formed on the surface of the substrate by means of the conductive ink, the conductive ink pattern is further cured to form a conductive pattern.

10. A method of forming a pattern comprising:
preparing a printing plate having a liquid-repellent face and a lyophilic pattern which are located adjacent to each other on a surface of the printing plate, the lyophilic pattern having a surface energy different from the liquid-repellent face;
retaining ink between an ink retention member and the surface of the printing plate including the lyophilic pattern;
moving the ink retention member relatively with respect to the printing plate while the ink is kept in contact with the surface of the printing plate, thereby applying the ink to the lyophilic pattern on the surface of the printing plate to form an ink pattern; and
transferring the ink pattern on the surface of the printing plate to a substrate,
wherein the lyophilic pattern includes a linear main lyophilic pattern and an auxiliary lyophilic pattern connected to the main lyophilic pattern,
a liquid-repellent region is defined in the liquid-repellent face between the main lyophilic pattern and the auxiliary lyophilic pattern, and
the liquid-repellent region is closed by a portion connecting the main lyophilic pattern and the auxiliary lyophilic pattern on an upstream side for a move direction of the ink surface and is open on a downstream side from the portion.

Assignees

• Toshiba Kk

Inventors

• Akiyama Masahiko

Classifications

• H05K3/1208

  Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38) · CPC title

• H01L51/0004

  Electricity · mapped topic

• H05K2203/1173

  Differences in wettability, e.g. hydrophilic or hydrophobic areas · CPC title

• C09D11/52 Primary

  Electrically conductive inks · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title