Substrate treatment method, and computer storage medium
US-2024036473-A1 · Feb 1, 2024 · US
US9746775B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9746775-B2 |
| Application number | US-201414888244-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 15, 2014 |
| Priority date | May 1, 2013 |
| Publication date | Aug 29, 2017 |
| Grant date | Aug 29, 2017 |
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Provided is a method for manufacturing a substrate having a concave pattern to be used for forming a high-definition pattern while suppressing wet-spreading and bleeding of a film-forming ink, provided is a composition to be used for manufacturing the substrate, and provided are a method for forming a conductive film, an electronic circuit, and an electronic device. The method for manufacturing a substrate having a concave pattern includes: (i) a step of applying, on a substrate 1 , a composition containing a polymer having an acid-dissociable group and an acid generator to form a coating film 2 and (ii) a step of irradiating a predetermined portion of the coating film 2 with radiation. The method for forming a conductive film includes applying a conductive film-forming ink on the concave pattern formed in the exposed portion of the coating film 2 and heating the ink to form a pattern 6 . The electronic circuit and the electronic device are provided by using the method for forming a conductive film.
Opening claim text (preview).
The invention claimed is: 1. A method for forming a conductive film, comprising: applying a composition on a substrate to form a coating film, wherein the composition comprises an acid generator and a polymer which comprises an acid dissociable group; irradiating a portion of the coating film with radiation; heating the coating film after the irradiating such that at least part of the portion of the coating film is evaporated and that a concave pattern is formed on the substrate; and applying a composition for conductive film formation on the substrate having the concave pattern to form the conducting film, wherein the concave pattern is formed without using a development of the coating film, and wherein a difference between a contact angle with respect to tetradecane of the irradiated portion of the coating film and a contact angle with respect to tetradecane of a portion of the coating film other than the irradiated portion is 30° or more. 2. The method according to claim 1 , wherein the acid-dissociable group comprises a fluorine atom. 3. The method according to claim 1 , wherein the irradiating produces a concave portion and a convex portion, and the concave portion has a film thickness of 10% or more lower than the convex portion. 4. The method according to claim 1 , wherein the acid-dissociable group is a group comprising an acetal bond. 5. The method according to claim 4 , wherein the group comprising an acetal bond comprises a group of formula (1-1): wherein: R 1 and R 2 each independently represent a hydrogen atom or a methyl group; Rf represents an organic group comprising a fluorine atom; and * represents a bonding site. 6. The method according to claim 1 , wherein the composition further comprises a polymerizable compound comprising an ethylenically unsaturated bond. 7. The method according to claim 6 , wherein the polymerizable compound comprises a trifunctional or higher functional (meth)acrylic acid ester. 8. The method according to claim 6 , wherein the composition further comprises a radiation-sensitive polymerization initiator. 9. The method according to claim 1 , wherein the polymer comprises at least one constitutional unit selected from constitutional units represented by formulae (2) to (4): wherein: R 3 independently represents a hydrogen atom or a methyl group; R 4 independently represents a methylene group, an alkylene group having 2 to 12 carbon atoms, an alkenylene group having 2 to 12 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group having 6 to 12 carbon atoms, a substituted or unsubstituted alicyclic hydrocarbon group having 4 to 12 carbon atoms, or a group in which one or more hydrogen atoms of each of these groups are substituted with fluorine atom(s); R 5 independently represents a hydrocarbon group in which one or more hydrogen atoms are substituted with fluorine atom(s); m represents 0 or 1; and n independently represents an integer of 0 to 12. 10. A method for producing an electronic circuit, comprising: applying a composition on a substrate to form a coating film, wherein the composition comprises an acid generator and a polymer which comprises an acid dissociable group; irradiating a portion of the coating film with radiation; heating the coating film after the irradiating such that at least part of the portion of the coating film is evaporated and that a concave pattern is formed on the substrate; and applying an ink composition for conductive film formation on the substrate having the concave pattern to form a conducting film pattern on the substrate having the concave pattern, the conducting film pattern being included in the electronic circuit, wherein the concave pattern is formed without using a development of the coating film, and wherein a difference between a contact angle with respect to tetradecane of the irradiated portion of the coating film and a contact angle with respect to tetradecane of a portion of the coating film other than the irradiated portion is 30° or more. 11. An electronic circuit comprising a conductive film pattern on a substrate having the concave pattern formed by the method according to claim 10 . 12. A method for producing an electronic device, comprising: applying a composition on a substrate to form a coating film, wherein the composition comprises an acid generator and a polymer which comprises an acid dissociable group; irradiating a portion of the coating film with radiation; heating the coating film after the irradiating such that at least part of the portion of the coating film is evaporated and that a concave pattern is formed on the substrate; and applying an ink composition for conductive film formation on the substrate having the concave pattern to form a conducting film pattern on the substrate having the concave pattern, the conducting film pattern being included in an electronic circuit of the electronic device, wherein the concave pattern is formed without using a development of the coating film, and wherein a difference between a contact angle with respect to tetradecane of the irradiated portion of the coating film and a contact angle with respect to tetradecane of a portion of the coating film other than the irradiated portion is 30° or more. 13. An electronic device comprising an electronic circuit formed by the methods according to claim 12 .
Photosensitive compositions · CPC title
with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title
Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching · CPC title
by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title
Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title
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