Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Patent metadata

Field	Value
Publication number	US-9967976-B2
Application number	US-201515536851-A
Country	US
Kind code	B2
Filing date	Dec 21, 2015
Priority date	Dec 25, 2014
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

First claim

The invention claimed is:

1. A substrate for a printed circuit board, comprising:
a base film having an insulating property; and
a conductive layer formed on at least one of surfaces of the base film,
wherein at least the conductive layer contains titanium in a dispersed manner, and
the base film is a flexible resin selected from a group consisting of polyimides, liquid-crystal polymers, fluororesins, polyethylene terephthalate, and polyethylene naphthalate,
wherein a mass ratio of titanium in the conductive layer is 10 ppm or more and 1,000 ppm or less.

2. The substrate for a printed circuit board according to claim 1 ,
wherein the conductive layer contains copper or a copper alloy as a main component.

3. The substrate for a printed circuit board according to claim 1 , wherein the conductive layer is formed by application and heating of a conductive ink containing metal particles.

4. The substrate for a printed circuit board according to claim 3 , wherein the conductive ink contains titanium or a titanium ion.

5. The substrate for a printed circuit board according to claim 3 , wherein the metal particles are obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

6. The substrate for a printed circuit board according to claim 1 , wherein the conductive layer is subjected to electroless plating so as to be filled with a metal derived from the electroless plating.

7. A printed circuit board comprising a conductive pattern,
wherein the conductive pattern is formed in the conductive layer of the substrate for a printed circuit board according to claim 1 by a subtractive method or a semi-additive method.

8. The substrate for a printed circuit board according to claim 1 , wherein the titanium is substantially uniformly present in the conductive layer.

9. A method for producing a substrate for a printed circuit board, the method comprising:
a step of precipitating metal particles by reducing metal ions, using trivalent titanium ions as a reducing agent, in an aqueous solution in which a metal compound and a dispersing agent are dissolved;
a step of preparing a conductive ink from the solution containing the metal particles after the precipitation step; and
a step of forming a conductive layer by applying the conductive ink to at least one of surfaces of a base film having an insulating property and by heating the conductive ink,
wherein at least the conductive layer contains titanium in a dispersed manner, and
the base film is a flexible resin selected from a group consisting of polyimides, liquid-crystal polymers, fluororesins, polyethylene terephthalate, and polyethylene naphthalate,
wherein the conductive ink preparation step includes a step of separating metal particles from the solution containing the metal particles, and a step of performing washing by adding pure water to the separated metal particles,
wherein the separation step and the washing step are repeated to adjust a mass ratio of titanium in the conductive layer by adjusting the number of times the foregoing steps are repeated,
wherein the mass ratio of titanium in the conductive layer is 10 ppm or more and 1,000 ppm or less.

10. The method for producing a substrate for a printed circuit board according to claim 9 , wherein the titanium is substantially uniformly present in the conductive layer.

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Printed Circuits Inc

Inventors

• Miyata Kazuhiro
• Okada Issei
• Kasuga Takashi
• Oka Yoshio
• Okuda Yasuhiro
• Park Jinjoo
• Ueda Hiroshi
• Miura Kousuke

Classifications

• H05K1/03

  Use of materials for the substrate · CPC title

• H05K3/245

  Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques · CPC title

• H05K2203/1131

  Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity · CPC title

• H05K3/1208

  Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38) · CPC title

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title