Manufacturing method of flexible printed wiring board
US-2016366768-A1 · Dec 15, 2016 · US
the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/027 |
| Official title | {the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles} |
| Display label | the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles |
| Total patents | 324 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 32 |
| 2016 | 34 |
| 2017 | 26 |
| 2018 | 37 |
| 2019 | 35 |
| 2020 | 40 |
| 2021 | 42 |
| 2022 | 33 |
| 2023 | 18 |
| 2024 | 14 |
| 2025 | 13 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Conductive paste, method of producing pattern, method of producing conductive paste, and sensor
US-2016358688-A1 · Dec 8, 2016 · US
Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Method For Manufacturing The Printed Wiring Board
US-2016353581-A1 · Dec 1, 2016 · US
Method of manufacturing rigid-flexible printed circuit board
US-2016345431-A1 · Nov 24, 2016 · US
Flexible electrode layer and manufacturing method thereof, display substrate and display device
US-2016338206-A1 · Nov 17, 2016 · US
Circuit substrate having a circuit pattern and method for making the same
US-9474161-B2 · Oct 18, 2016 · US
Printed wiring board and method for manufacturing the same
US-2016295692-A1 · Oct 6, 2016 · US
Graphite sheet, method for producing same, laminated board for wiring, graphite wiring material, and process for producing wiring board
US-2016249453-A1 · Aug 25, 2016 · US
Protective coating for printed conductive pattern on patterned nanowire transparent conductors
US-2016249461-A1 · Aug 25, 2016 · US
Methods and apparatus to form electrical interconnects on ophthalmic devices
US-9425571-B2 · Aug 23, 2016 · US
Method for manufacturing printed wiring board
US-9420697-B2 · Aug 16, 2016 · US
Non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate
US-9420699-B2 · Aug 16, 2016 · US
Zero-Misalignment Via-Pad Structures
US-2016183370-A1 · Jun 23, 2016 · US
Printed circuit board and method of manufacturing the same
US-2016183372-A1 · Jun 23, 2016 · US
COMPOSITION AND METHOD FOR FORMING CONDUCTIVE PATTERN, AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN THEREON(As amended)
US-2016174370-A1 · Jun 16, 2016 · US
Printed wiring board and method for manufacturing the same
US-2016113120-A1 · Apr 21, 2016 · US
Substrate cover
US-2016105945-A1 · Apr 14, 2016 · US
Printed wiring board with metal post and method for manufacturing the same
US-2016100482-A1 · Apr 7, 2016 · US
Non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate
US-9295162-B2 · Mar 22, 2016 · US
Touch screen, method for producing touch screen, touch display device
US-2016077628-A1 · Mar 17, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/027?
- CPC H05K3/027 is the Cooperative Patent Classification code for “the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles.”
- How many patents are filed under CPC H05K3/027 (the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles)?
- Our database includes 324 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/027 growing?
- Publication counts under this code: 14 in 2024 vs 13 in 2025 (latest complete years).