Manufacturing method of flexible printed wiring board

Patent metadata

Field	Value
Publication number	US-2016366768-A1
Application number	US-201515107931-A
Country	US
Kind code	A1
Filing date	Feb 16, 2015
Priority date	Feb 16, 2015
Publication date	Dec 15, 2016
Grant date	—

Abstract

The manufacturing method of the flexible printed wiring board relating to an embodiment includes a step of preparing a metal foil clad laminate 1 including an insulating substrate 2 and metal foil 3 and metal foil 4 provided on main surfaces of the substrate 2, a step of forming a circuit pattern 5 by patterning the metal foil 3, a step of forming a peelable printing plate layer 6 on the substrate 2 so as to embed the pattern 5, a step of forming blind holes 7 a and 7 b where the pattern 5 is exposed inside by partially removing the printing plate layer 6, a step of printing conductive paste with the printing plate layer 6 as a printing mask, and filling the conductive paste 8 inside the blind holes, and a step of peeling off the printing plate layer 6 from the metal foil clad laminate 1.

First claim

1 . A manufacturing method of a flexible printed wiring board comprising:
a step of preparing a metal foil clad laminate including an insulating substrate and metal foil provided on at least one of main surfaces of the insulating substrate; a step of forming a circuit pattern by patterning the metal foil; a step of forming a peelable printing plate layer on the insulating substrate so as to embed the circuit pattern; a step of forming a blind hole where the circuit pattern is exposed inside by partially removing the printing plate layer; a step of printing conductive paste with the printing plate layer as a printing mask, and filling the conductive paste inside the blind hole; and a step of peeling off the printing plate layer from the metal foil clad laminate.

2 . The manufacturing method of the flexible printed wiring board according to claim 1 ,
wherein the metal foil clad laminate is a double-sided metal foil clad laminate provided with first metal foil and second metal foil respectively on a front surface and a back surface of the insulating substrate, and the circuit pattern includes a conformal mask, and wherein, in the step of forming the blind hole, by irradiating the printing plate layer with a laser beam and partially removing the printing plate layer and the insulating substrate, a bottomed step via hole where the first metal foil is exposed in the middle and the second metal foil is exposed at a bottom surface is formed as the blind hole.

3 . The manufacturing method of the flexible printed wiring board according to claim 1 ,
wherein the circuit pattern includes wiring, and wherein, in the step of forming the blind hole, by irradiating the printing plate layer with a laser beam and partially removing the printing plate layer, the blind hole where the wiring is exposed at a bottom surface is formed.

4 . The manufacturing method of the flexible printed wiring board according to claim 1 ,
wherein the printing plate layer is formed by sticking a film with a slightly adhesive material to the metal foil clad laminate.

5 . The manufacturing method of the flexible printed wiring board according to claim 1 ,
wherein the printing plate layer is formed by sticking a UV curing type adhesive film to the metal foil clad laminate, adhesiveness is extinguished by irradiating the UV curing type adhesive film with UV light after the conductive paste is printed, and the UV curing type adhesive film is peeled off from the metal foil clad laminate.

6 . The manufacturing method of the flexible printed wiring board according to claim 1 ,
wherein, in the step of preparing the metal foil clad laminate, a roll-like metal foil clad laminate is prepared as the metal foil clad laminate, and the steps from the step of forming the circuit pattern to at least the step of printing the conductive paste are carried out by a roll-to-roll method.

7 . The manufacturing method of the flexible printed wiring board according to claim 6 , further comprising
a step of thermally curing the conductive paste and forming an insulating protective layer at a predetermined part of the metal foil clad laminate, wherein the steps from the step of forming the circuit pattern to the step of forming the insulating protective layer are carried out by the roll-to-roll method

8 . A manufacturing method of a flexible printed wiring board comprising:
a step of preparing a metal foil clad laminate including an insulating substrate and metal foil provided on at least one of main surfaces of the insulating substrate; a step of forming a circuit pattern including wiring and a first receiving land and a second receiving land arranged respectively on both sides of the wiring by patterning the metal foil; a step of forming an insulating protective layer so as to embed the circuit pattern; a step of forming a peelable printing plate layer on the insulating protective layer; a process of forming a jumper opening including a first blind hole where the first receiving land is exposed inside, a second blind hole where the second receiving land is exposed inside, and a connecting groove part where the insulating protective layer is exposed at a bottom surface and which connects the first blind hole and the second blind hole; a step of printing conductive paste with the printing plate layer and the insulating protective layer as a printing mask, and filling the conductive paste inside the jumper opening; and a step of peeling off the printing plate layer from the metal foil clad laminate.

Assignees

• Nippon Mektron Kk

Inventors

• Matsuda Fumihiko

Classifications

• H05K3/4053 Primary

  by thick-film techniques · CPC title

• H05K2201/0145

  Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] · CPC title

• H05K3/4685

  Manufacturing of cross-over conductors · CPC title

• H05K2201/09509

  Blind vias, i.e. vias having one side closed · CPC title

• H05K2201/10363

  Jumpers, i.e. non-printed cross-over connections · CPC title