Printed wiring board with metal post and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016100482-A1
Application number	US-201514874647-A
Country	US
Kind code	A1
Filing date	Oct 5, 2015
Priority date	Oct 3, 2014
Publication date	Apr 7, 2016
Grant date	—

Abstract

A printed wiring board includes a resin insulating layer, a conductor layer formed on the resin insulating layer and including conductor pads, a solder resist layer formed on the resin insulating layer such that the solder resist layer is covering the conductor layer and has opening portions exposing the conductor pads, respectively, and metal posts formed on the conductor pads such that each of the metal posts is protruding from the solder resist layer and has a side surface forming an angle with respect to a surface of the solder resist layer.

First claim

What is claimed is:

1 . A printed wiring board, comprising:
a resin insulating layer; a conductor layer formed on the resin insulating layer and comprising a plurality of conductor pads; a solder resist layer formed on the resin insulating layer such that the solder resist layer is covering the conductor layer and has a plurality of opening portions exposing the plurality of conductor pads, respectively; and a plurality of metal posts formed on the plurality of conductor pads such that each of the metal posts is protruding from the solder resist layer and has a side surface forming an angle with respect to a surface of the solder resist layer.

2 . A printed wiring board according to claim 1 , wherein each of the metal posts has the side surface such that a portion of the side surface protruding from the solder resist layer forms the angle in a range of 45 degrees to 90 degrees with respect to the surface of the solder resist layer.

3 . A printed wiring board according to claim 1 , wherein the plurality of metal posts comprises electroless nickel plating.

4 . A printed wiring board according to claim 3 , wherein the plurality of metal posts comprises the electroless nickel plating having a phosphorus content in a range of 5% to 12%.

5 . A printed wiring board according to claim 1 , further comprising:
an intermediate metal layer formed on the plurality of metal posts such that the intermediate metal layer is formed only on an upper surface of each of the metal posts.

6 . A printed wiring board according to claim 5 , wherein the intermediate metal layer comprises a palladium layer formed on the upper surface of each of the metal posts and a gold layer formed on the palladium layer.

7 . A printed wiring board according to claim 1 , wherein the solder resist layer has the plurality of opening portions formed such that each of the opening portions has an inner wall surface linearly intersects a surface of a respective one of the conductor pads.

8 . A printed wiring board according to claim 1 , wherein the solder resist layer has the plurality of opening portions formed such that each of the opening portions has an inner wall surface curvedly intersects a surface of a respective one of the conductor pads.

9 . A printed wiring board according to claim 1 , wherein the plurality of metal posts is formed at a pitch in a range of 30 μm to 80 μm.

10 . A printed wiring board according to claim 2 , wherein the plurality of metal posts comprises electroless nickel plating.

11 . A printed wiring board according to claim 10 , wherein the plurality of metal posts comprises the electroless nickel plating having a phosphorus content in a range of 5% to 12%.

12 . A printed wiring board according to claim 2 , further comprising:
an intermediate metal layer formed on the plurality of metal posts such that the intermediate metal layer is formed only on an upper surface of each of the metal posts.

13 . A printed wiring board according to claim 12 , wherein the intermediate metal layer comprises a palladium layer formed on the upper surface of each of the metal posts and a gold layer formed on the palladium layer.

14 . A printed wiring board according to claim 2 , wherein the solder resist layer has the plurality of opening portions formed such that each of the opening portions has an inner wall surface linearly intersects a surface of a respective one of the conductor pads.

15 . A printed wiring board according to claim 2 , wherein the solder resist layer has the plurality of opening portions formed such that each of the opening portions has an inner wall surface curvedly intersects a surface of a respective one of the conductor pads.

16 . A printed wiring board according to claim 2 , wherein the plurality of metal posts is formed at a pitch in a range of 30 μm to 80 μm.

17 . A printed wiring board according to claim 1 , wherein the plurality of metal posts is made of electroless nickel plating.

18 . A method for manufacturing a printed wiring board, comprising:
preparing a printed wiring board comprising a resin insulating layer, and a conductor layer formed on the resin insulating layer and comprising a plurality of conductor pads; forming a solder resist layer on the resin insulating layer such that the solder resist layer covers the conductor layer; affixing a resin film having a bonding layer on the solder resist layer; forming a plurality of opening portions penetrating through the solder resist layer and the resin film such that the plurality of opening portions reaches the plurality of conductor pads, respectively; forming a plurality of metal posts in the plurality of opening portions respectively such that the plurality of metal posts connects to the plurality of conductor pads, respectively; and peeling off the resin film from the solder resist layer such that each of the metal posts is protruding from the solder resist layer and has a side surface forming an angle with respect to a surface of the solder resist layer.

19 . A method for manufacturing a printed wiring board according to claim 18 , wherein the forming of the opening portions comprises irradiating laser upon the resin film such that the plurality of opening portions reaches the plurality of conductor pads through the solder resist layer and the resin film, respectively.

20 . A method for manufacturing a printed wiring board according to claim 18 , wherein the forming of the opening portions comprises etching the resin film and the solder resist layer such that the plurality of opening portions reaches the plurality of conductor pads through the solder resist layer and the resin film, respectively.

Assignees

• Ibiden Co Ltd

Inventors

• Kunieda Masatoshi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K3/4007 Primary

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title