Protective coating for printed conductive pattern on patterned nanowire transparent conductors

Patent metadata

Field	Value
Publication number	US-2016249461-A1
Application number	US-201415025696-A
Country	US
Kind code	A1
Filing date	Sep 22, 2014
Priority date	Sep 30, 2013
Publication date	Aug 25, 2016
Grant date	—

Abstract

A method for making an electronic assembly includes applying a protective layer including an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit overlies at least a portion of a conductive layer on a substrate, and wherein the conductive layer includes nanowires; and engaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer.

First claim

1 . A method for making an electronic assembly, comprising:
applying a protective layer comprising an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit is electrically connected to a conductive layer on a substrate, and wherein the conductive layer comprises nanowires; and engaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer.

2 . The method of claim 1 , wherein the organosulfur compound is selected from at least one of alkyl thiols and aryl thiols.

3 . The method of claim 1 , wherein the organosulfur compound is an alkyl thiol.

4 . The method of claim 1 , wherein the patterned conductive layer is transparent.

5 . A method, comprising:
coating a substrate with a conductive layer comprising nanowires; applying a pattern of a conductive interconnect material on the conductive layer to generate on the substrate one or more first regions of exposed conductive layer and one or more second regions of conductive interconnect material; hardening or curing the conductive interconnect material to form a patterned interconnect circuit; applying on at least a portion of the patterned interconnect circuit a protective layer forming composition comprising an organosulfur compound; overcoating the patterned interconnect circuit and the protective layer forming composition with a liquid strippable polymer layer-forming composition; hardening or curing the strippable polymer layer-forming composition to form a strippable polymer layer; peeling the strippable polymer layer from the substrate; and removing the exposed conductive layer from the substrate in the one or more first regions of the substrate to form a patterned conductive layer on the substrate, wherein the patterned conductive layer is at least partially overlain by the patterned interconnect circuit, and the patterned interconnect circuit is at least partially overlain by the protective layer.

6 . The method of claim 5 , further comprising drying the protective layer-forming composition to form a protective layer prior to overcoating with the strippable polymer layer forming composition.

7 . A method, comprising:
coating a substrate with a conductive layer comprising nanowires; applying a pattern on the conductive layer with a conductive interconnect material to generate on the substrate one or more first regions of exposed conductive layer and one or more second regions of conductive interconnect material; hardening or curing the conductive interconnect material to form a patterned interconnect circuit; overcoating the pattern with a liquid strippable polymer layer-forming composition, wherein the strippable polymer layer-forming composition comprises an organosulfur compound; hardening or curing the strippable polymer layer-forming composition to form a strippable polymer layer; peeling the strippable polymer layer from the substrate; and removing the exposed conductive layer from the substrate in the one or more first regions of the substrate to form a patterned conductive layer on the substrate, wherein the patterned conductive layer is at least partially overlain by the patterned interconnect circuit, and the patterned interconnect circuit is at least partially overlain by a protective layer comprising the organosulfur compound.

8 . An electronic assembly made according to the method of claim 1 .

9 . An electronic assembly, comprising:
a substrate comprising thereon a pattern of conductive nanowires, wherein the conductive nanowires are electrically connected to a conductive interconnect circuit, and wherein at least a portion of the conductive interconnect circuit is overlain by a protective layer comprising an organosulfur compound; and an electrical contact of an electronic component in contact with the protective layer.

10 . The electronic assembly of claim 9 , further comprising a conductive layer between the substrate and the electronic component.

11 . The electronic assembly of claim 10 , wherein the conductive layer comprises a conductive adhesive.

12 . The electronic assembly of claim 9 , wherein the electronic component comprises a flexible circuit.

13 . The electronic assembly of claim 9 , wherein the organosulfur compound is selected from at least one of alkyl thiols and aryl thiols.

14 . The electronic assembly of any of claim 9 , wherein the organosulfur compound is an alkyl thiol.

15 . A touch screen display comprising:
a liquid crystal display; and an electronic assembly comprising: a glass substrate on the liquid crystal display, wherein the glass substrate comprises thereon a pattern of conductive nanowires, wherein the conductive nanowires are electrically connected to a patterned conductive interconnect circuit, and wherein at least a portion of the interconnect circuit is overlain by a protective layer comprising an organosulfur compound; and an electrical contact of an flexible circuit in contact with the protective layer; and a flexible transparent surface overlying the electronic assembly.

16 . The display of claim 15 , further comprising a conductive layer between the substrate and the flexible circuit.

17 . The display of claim 16 , wherein the conductive layer comprises a conductive adhesive.

18 . The display of claim 15 , wherein the organosulfur compound is selected from at least one of alkyl thiols and aryl thiols.

19 . The display of claim 18 , wherein the organosulfur compound is an alkyl thiol.

Assignees

• 3M Innovative Properties Co

Inventors

• Gilman Ann M
• Pekurovsky Mikhail L
• Stay Matthew S
• Dodds Shawn C
• Theis Daniel J

Classifications

• G06F3/041 Primary

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• Y10S977/762

  Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less · CPC title

• B82Y15/00

  Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors · CPC title

• Y10S977/956

  Of mechanical property · CPC title

• G06F2203/04102

  Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper · CPC title