Multilayer ceramic substrate and method for manufacturing same
US-10455699-B2 · Oct 22, 2019 · US
Punching of holes
Punching of holes · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/005 |
| Official title | {Punching of holes} |
| Display label | Punching of holes |
| Total patents | 119 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 9 |
| 2017 | 18 |
| 2018 | 15 |
| 2019 | 13 |
| 2020 | 18 |
| 2021 | 9 |
| 2022 | 10 |
| 2023 | 6 |
| 2024 | 7 |
| 2025 | 6 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor
US-10446335-B2 · Oct 15, 2019 · US
Method for the electrical passivation of electrode arrays and/or conductive paths in general, and a method for producing stretchable electrode arrays and/or stretchable conductive paths in general
US-10448514-B2 · Oct 15, 2019 · US
Printer and printing method for printing of printed circuit boards
US-10342139-B2 · Jul 2, 2019 · US
Heart activity sensor structure
US-10314506-B2 · Jun 11, 2019 · US
Filling method of conductive paste and manufacturing method of multi-layer printed circuit board
US-10321578-B2 · Jun 11, 2019 · US
Image pickup element mounting substrate and image pickup device
US-10319759-B2 · Jun 11, 2019 · US
Printed circuit board with heat sink
US-2019090343-A1 · Mar 21, 2019 · US
Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring board
US-2019036289-A1 · Jan 31, 2019 · US
Composite flexible printed wiring board and method for manufacturing composite flexible printed wiring board
US-2019036247-A1 · Jan 31, 2019 · US
Printed Circuit Board Solder Joints
US-2019006777-A1 · Jan 3, 2019 · US
Manufacturing method for a sensing element and sensor device
US-2018330874-A1 · Nov 15, 2018 · US
Method of making printed circuit board structure including a closed cavity
US-2018324960-A1 · Nov 8, 2018 · US
Multilayer ceramic substrate and method for manufacturing same
US-2018220532-A1 · Aug 2, 2018 · US
Flexible printed circuit board
US-2018192511-A1 · Jul 5, 2018 · US
Composite type LED circuit board and manufacturing method
US-9951932-B2 · Apr 24, 2018 · US
Cortical implant system for brain stimulation and recording
US-9949376-B2 · Apr 17, 2018 · US
Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
US-9936590-B2 · Apr 3, 2018 · US
Heat dissipation structure, method for making the same, and electronic device having the same
US-2018082924-A1 · Mar 22, 2018 · US
Board having electronic element, method for manufacturing the same, and electronic element module including the same
US-2018063961-A1 · Mar 1, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/005?
- CPC H05K3/005 is the Cooperative Patent Classification code for “Punching of holes.”
- How many patents are filed under CPC H05K3/005 (Punching of holes)?
- Our database includes 119 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/005 growing?
- Publication counts under this code: 7 in 2024 vs 6 in 2025 (latest complete years).