Image pickup element mounting substrate and image pickup device

Patent metadata

Field	Value
Publication number	US-10319759-B2
Application number	US-201515316916-A
Country	US
Kind code	B2
Filing date	Jun 24, 2015
Priority date	Jun 25, 2014
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

An image pickup element mounting substrate includes: a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body; an electronic component mounted on a lower surface side of the frame body; and a flat plate which is disposed on a lower surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate including an image pickup element mounting section at a part of an upper surface thereof which part is surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate.

First claim

The invention claimed is:

1. An image pickup element mounting substrate, comprising:
a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body;
an electronic component mounted on a lower outer surface of the frame body; and
a flat plate which is disposed on the lower outer surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate comprising an image pickup element mounting section at a first part of an upper surface of the flat plate, the first part of the upper surface being surrounded by the frame body,
a lower surface of the electronic component being located above a level of a lower surface of the flat plate.

2. The image pickup element mounting substrate according to claim 1 ,
wherein the flat plate is provided with a flat-plate recess formed at a second part of the upper surface of the flat plate, the second part of the upper surface overlapping with the electronic component.

3. The image pickup element mounting substrate according to claim 1 ,
wherein the flat plate is provided with a flat-plate through hole formed in a position which overlaps with the electronic component.

4. An image pickup device, comprising:
the image pickup element mounting substrate according to claim 1 ;
an image pickup element mounted on the image pickup element mounting section of the flat plate; and
a lid body which is joined to an upper surface of the frame body and seals an interior of the frame body.

5. The image pickup element mounting substrate according to claim 1 , wherein the flat plate is directly connected to the frame body.

6. An image pickup element mounting substrate, comprising:
a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body, the frame body being provided with a frame-body recess which opens on a lower outer surface of the frame body;
an electronic component mounted in the frame-body recess; and
a flat plate which is disposed on the lower outer surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate comprising an image pickup element mounting section at a first part of an upper surface of the flat plate, the first part of the upper surface being surrounded by the frame body,
a lower surface of the electronic component being located above a level of a lower surface of the flat plate.

7. The image pickup element mounting substrate according to claim 6 ,
wherein the flat plate is provided with a flat-plate recess formed at a second part of the upper surface of the flat plate, the second part of the upper surface overlapping with the frame-body recess.

8. The image pickup element mounting substrate according to claim 6 ,
wherein the flat plate is provided with a flat-plate through hole formed in a position which overlaps with the electronic component.

9. An image pickup device, comprising:
the image pickup element mounting substrate according to claim 6 ;
an image pickup element mounted on the image pickup element mounting section of the flat plate; and
a lid body which is joined to an upper surface of the frame body and seals an interior of the frame body.

10. The image pickup element mounting substrate according to claim 6 , wherein the flat plate is directly connected to the frame body.

Assignees

• Kyocera Corp

Inventors

• Okamura Takuji
• Funahashi Akihiko

Classifications

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H05K1/184

  associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes · CPC title

• H05K3/4697

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K2203/063

  of preperforated insulating layer · CPC title