Printer and printing method for printing of printed circuit boards

Patent metadata

Field	Value
Publication number	US-10342139-B2
Application number	US-201514961201-A
Country	US
Kind code	B2
Filing date	Dec 7, 2015
Priority date	Nov 13, 2015
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

A printer includes a belt, a tray and a plurality of printing devices located over the belt. The tray is located on the belt and receives a printed circuit board (PCB). A sensor attached to the tray. The sensor is used to sense whether the PCB is located in the tray, when the PCB is located in the tray, the belt is driven by a driving device to transport the tray to be located below each of the plurality of printing devices. Each of the plurality of printing devices is used to print the PCB. The disclosure further offers a printing method for the PCB using the printer.

First claim

What is claimed is:

1. A printer comprising:
a belt;
a tray arranged on the belt and configured to receive a printed circuit board (PCB) therein;
a sensor attached to the tray and configured to sense whether the PCB is located in the tray; and
a plurality of processing devices located along the belt;
wherein when the PCB is loaded in the tray, the belt is driven by a driving device to transport the tray below toward each of the plurality of processing devices; and
wherein the plurality of processing devices comprises
a punching device configured to punch the PCB;
a first line printing device, arranged downstream of the punching device and configured to print a conductive line pattern on a first side of the PCB;
a layer printing device, arranged downstream of the line printing device and configure to print a solder layer of the PCB;
a white text and marking printing device, arranged downstream of the layer printing device and configure to print white text and marking on the PCB; and
a solder bump printing device, arranged downstream of the white text and marking printing device and configure to print a solder material onto the PCB.

2. The printer of claim 1 , wherein the plurality of devices comprises a feeding device, the feeding device comprises a feeding box above the tray and a plurality of gears located on the feeding box, and the plurality of gears are configured to drop the PCB into the tray.

3. The printer of claim 2 , wherein the plurality of gears comprises two pairs of gears, a first pair of gears is located on a first side of the feeding box, and a second pair of gears is located on a second opposite side of the feeding box.

4. The printer of claim 1 , wherein the PCB is a multilayer board, the plurality of devices further comprises a flipping device, and the flipping device is configured to flip the PCB.

5. The printer of claim 4 , wherein the flipping device comprises a securing pole, a first rotatable catch and a second rotatable catch, and the first rotatable catch and the second rotatable catch are coupled to opposite ends of the securing pole.

6. The printer of claim 4 , wherein the plurality of devices further comprises a brush, and the brush is configured to brush adhesive on the PCB.

7. The printer of claim 1 , wherein the PCB is a multilayer board, the plurality of devices comprises a flipping device and a pressing device, the flipping device is configured to flip the PCB, and the pressing device is configured to press the PCB.

8. The printer of claim 4 , further comprises a second line printing device arranged downstream of the flipping device and configured to print a conductive line pattern on a second side of the PCB.

9. The printer of claim 1 , wherein the line printing device is configured to print conductive line pattern on the PCB using at least one of conductive adhesive or conductive ink.

10. The printer of claim 9 , wherein the line printing device is configured to adjust a thickness of printed conductive line pattern according to a viscosity of the conductive adhesive or ink.

11. The printer of claim 9 , wherein the conductive ink has particles with diameters less than 0.1 micron.

Assignees

• Fu Tai Hua Ind Shenzhen Co Ltd
• Hon Hai Prec Ind Co Ltd

Inventors

• Zhang xue-qin

Classifications

• G05B2219/49023

  3-D printing, layer of powder, add drops of binder in layer, new powder · CPC title

• H05K3/0097

  Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence) · CPC title

• H05K3/0085

  Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor (apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K13/00) · CPC title

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H05K3/1275

  by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing · CPC title