Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor

Patent metadata

Field	Value
Publication number	US-10446335-B2
Application number	US-201414555633-A
Country	US
Kind code	B2
Filing date	Nov 27, 2014
Priority date	Aug 8, 2013
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A chip socket defined by an organic matrix framework, wherein the organic matrix framework comprises at least one via post layer where at least one via through the framework around the socket includes at least one capacitor comprising a lower electrode, a dielectric layer and an upper electrode in contact with the via post.

First claim

What is claimed is:

1. A chip socket for an embedded chip defined by a frame around a socket, the frame having an organic matrix, wherein the frame comprises at least one via post layer comprising at least one via post, wherein at least one capacitor coupled to at least one via post is incorporated within the frame around the chip socket.

2. The chip socket of claim 1 , wherein a dielectric of the capacitor comprises at least one of the group consisting of Ta 2 O 5 , TiO 2 , Ba x Sr 1-x TiO 3 , BaTiO 3 , BaO 4 SrTi and Al 2 O 3 .

3. The chip socket of claim 1 , wherein a lower electrode of the capacitor comprises a noble metal.

4. The chip socket of claim 1 , wherein the lower electrode of the capacitor comprises a metal selected from the group consisting of gold, platinum and tantalum.

5. The chip socket of claim 1 , wherein an upper electrode of the capacitor comprises a metal selected from the group consisting of gold, platinum and tantalum.

6. The chip socket of claim 1 , wherein the capacitor comprises a lower electrode layer, a dielectric layer and an upper electrode layer, and the at least one via post stands on the upper electrode layer.

7. The chip socket of claim 1 , wherein the capacitor comprises a lower electrode layer and a dielectric layer and the at least one via post stands on the dielectric layer and serves as the upper electrode of the capacitor.

8. The chip socket of claim 7 , wherein contact area of the via post in contact with the dielectric layer multipled by dielectric constant of the dielectric layer divided by thickness of the dielectric layer is capacitance of the capacitor.

9. The chip socket of claim 1 , wherein the at least one capacitor has a capacitance of between 1.5 pF and 300 pF.

10. The chip socket of claim 1 , wherein the at least one capacitor has a capacitance of between 5 pF and 45 pF.

11. The chip socket of claim 1 wherein the frame further comprises at least one feature layer.

12. The chip socket of claim 1 , wherein at least one electronic component is embedded within the socket and is electrically coupled to the at least one via.

13. The chip socket of claim 12 , wherein the at least one electronic component comprises a second capacitor.

14. The chip socket of claim 13 , wherein the second capacitor is a discrete component having a metal termination on at least one end.

15. The chip socket of claim 13 , wherein the second capacitor is a Metal-Insulator-Metal (MIM) capacitor.

16. The chip socket of claim 15 , wherein the Metal-Insulator-Metal (MIM) capacitor comprises a dielectric layer consisting of at least one of the group consisting of Ta 2 O 5 , TiO 2 , Ba x Sr 1-x TiO 3 , BaTiO 3 , BaO 4 SrTi and Al 2 O 3 .

17. The chip socket of claim 15 , wherein a lower electrode of the Metal-Insulator-Metal (MIM) capacitor comprises a noble metal.

18. The chip socket of claim 15 , wherein an upper electrode of the Metal-Insulator-Metal (MIM) capacitor comprises a metal selected from the group consisting of gold, platinum and tantalum.

19. The chip socket of claim 13 , wherein the lower electrode comprises a metal selected from the group consisting of gold, platinum and tantalum.

20. The chip socket of claim 13 , wherein electrodes of the Metal-Insulator-Metal (MIM) capacitor are coupled to vias by feature layers.

21. The chip socket of claim 20 , wherein a feature layer on one side of the frame and embedded components comprises an inductor.

22. The chip socket of claim 20 wherein embedded components within the frame, socket and at least one feature within the feature layer provides a filter.

23. The chip socket of claim 22 , wherein the filter is selected from the group consisting of basic LC low pass filters, LC high pass filters, LC series band pass filters, LC parallel band pass filters and Low Pass Parallel-Chebyshev filters.

24. The chip socket of claim 1 , wherein a chip mounted in a socket is protected from electromagnetic radiation by a Faraday cage comprising via posts within the frame, thereby minimizing electromagnetic interference.

25. The chip socket of claim 24 wherein at least some of the via posts extend in the XY plane.

26. The chip socket for an embedded chip of claim 1 wherein there are a plurality of chip sockets, each one of the chip sockets defined by a respective frame around a respective socket, the respective frame having an organic matrix, wherein the respective frame comprises at least on via post layer comprising at least one via post, wherein at least one capacitor coupled to at least one via post is incorporated within the respective frame around the chip socket.

27. The chip socket of claim 26 wherein the plurality of chip sockets are arranged as an array.

28. The chip socket of claim 27 wherein at least one processor chip is embedded in a first of the plurality of sockets.

29. The chip socket of claim 28 wherein a passive chip comprising at least one capacitor is embedded in a second of the plurality of sockets.

30. The chip socket of claim 26 wherein the at least one capacitor is coupled with at least one inductor in series.

Assignees

• Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Tech Co Ltd
• Zhuhai Access Semiconductor Co Ltd

Inventors

• Hurwitz Dror
• Huang Alex

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title