Circuit board, electronic device, and production method for circuit board
US-12156346-B2 · Nov 26, 2024 · US
Anti metal-migration, e.g. avoiding tin whisker growth
Anti metal-migration, e.g. avoiding tin whisker growth · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2201/0769 |
| Official title | Anti metal-migration, e.g. avoiding tin whisker growth |
| Display label | Anti metal-migration, e.g. avoiding tin whisker growth |
| Total patents | 132 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 18 |
| 2017 | 15 |
| 2018 | 18 |
| 2019 | 19 |
| 2020 | 11 |
| 2021 | 16 |
| 2022 | 3 |
| 2023 | 4 |
| 2024 | 8 |
| 2025 | 2 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flexible printed circuit board
US-2018368265-A1 · Dec 20, 2018 · US
Method of making a flexible printed circuit board
US-2018310412-A1 · Oct 25, 2018 · US
Method of making a flexible printed circuit board
US-10111336-B1 · Oct 23, 2018 · US
Conductive film, conductive film manufacturing method, and touch panel
US-10108304-B2 · Oct 23, 2018 · US
Method for producing metal/ceramic circuit board
US-2018255645-A1 · Sep 6, 2018 · US
Ceramic circuit board and electronic device
US-2018213640-A1 · Jul 26, 2018 · US
Solder alloy
US-2018105899-A1 · Apr 19, 2018 · US
Process for Forming a Cobalt-Iron Alloy Film on a Substrate
US-2018100218-A1 · Apr 12, 2018 · US
Printed wiring board
US-2018084641-A1 · Mar 22, 2018 · US
Circuit board and production method therefor
US-2018035549-A1 · Feb 1, 2018 · US
Conductive film forming composition, conductive film, and wiring board
US-9859036-B2 · Jan 2, 2018 · US
Solder alloy for plating and electronic component
US-2017348805-A1 · Dec 7, 2017 · US
Coating for the mitigation of metal whiskers
US-2017349767-A1 · Dec 7, 2017 · US
Printed wiring board
US-9736945-B2 · Aug 15, 2017 · US
Wiring board
US-2017215277-A1 · Jul 27, 2017 · US
Printed wiring board and method for manufacturing the same
US-9711439-B2 · Jul 18, 2017 · US
Wiring board and electronic component device
US-9698094-B2 · Jul 4, 2017 · US
Arrangement with circuit carrier for an electronic device
US-2017187131-A1 · Jun 29, 2017 · US
Wiring board
US-9693453-B2 · Jun 27, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2201/0769?
- CPC H05K2201/0769 is the Cooperative Patent Classification code for “Anti metal-migration, e.g. avoiding tin whisker growth.”
- How many patents are filed under CPC H05K2201/0769 (Anti metal-migration, e.g. avoiding tin whisker growth)?
- Our database includes 132 publications tagged with this CPC code.
- Is patent activity under CPC H05K2201/0769 growing?
- Publication counts under this code: 8 in 2024 vs 2 in 2025 (latest complete years).