Conductive film forming composition, conductive film, and wiring board

Patent metadata

Field	Value
Publication number	US-9859036-B2
Application number	US-201514869503-A
Country	US
Kind code	B2
Filing date	Sep 29, 2015
Priority date	Mar 29, 2013
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

A conductive film forming composition includes a fluorine atom-containing migration inhibitor and a metal particle, with the migration inhibitor including at least one selected from the group consisting of compounds represented by General Formulae (1) to (5), (22) and (23) as well as compounds having a group of General Formula (24) and a group of General Formula (25). The conductive film forming composition makes it possible to form a conductive film excellent in conductive characteristics and ion migration inhibiting function.

First claim

What is claimed is:

1. A conductive film forming composition, comprising:
a migration inhibitor containing a fluorine atom; and
a metal particle,

wherein the migration inhibitor includes polymer A having a repeating unit represented by General Formula (26) and a repeating unit represented by General Formula (27):

in General Formula (26) and General Formula (27): each of R 261 and R 262 independently represents a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms; each of R 241 and R 244 independently represents a hydrogen atom; each of R 242 and R 243 independently represents an alkyl group; Z 2 represents a single bond, an ester group, an amido group, or an ether group; L 4 represents a single bond or a divalent organic group; L 5 represents a single bond or a divalent organic group having 1 to 6 carbon atoms and containing no fluorine; X represents a hydrogen atom, a fluorine atom, or a trifluoromethyl group; Rf represents a fluoroalkyl group having 20 or less carbon atoms, which may have an ethereal oxygen atom and in which at least one hydrogen atom is substituted with a fluorine atom, or represents a fluorine atom.

2. The conductive film forming composition according to claim 1 , wherein a metal atom contained in the metal particle is selected from the group consisting of gold, silver, copper, and aluminum.

3. A conductive film, which is made of the conductive film forming composition according to claim 1 .

4. A conductive film, which is made of the conductive film forming composition according to claim 2 .

Assignees

• Fujifilm Corp

Inventors

• Matsushita Yasuaki
• Matsumura Tokihiko

Classifications

• C09D5/24

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• H05K3/282

  for inhibiting the corrosion of the circuit, e.g. for preserving the solderability · CPC title

• H01B3/445

  from vinylfluorides or other fluoroethylenic compounds · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K3/125

  by ink-jet printing · CPC title