Wiring board and electronic component device

Patent metadata

Field	Value
Publication number	US-9698094-B2
Application number	US-201615228059-A
Country	US
Kind code	B2
Filing date	Aug 4, 2016
Priority date	Aug 6, 2015
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A wiring board includes: an insulating layer; and a wiring layer including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and the side surface and the lower surface of the wiring layer are embedded in the insulating layer. A recess portion is formed in an outer edge portion of the upper surface of the wiring layer, and the recess portion is filled with the insulating layer.

First claim

What is claimed is:

1. A wiring board comprising:
an insulating layer; and
a wiring layer comprising: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and the side surface and the lower surface of the wiring layer are embedded in the insulating layer,
wherein a recess portion is formed in an outer edge portion of the upper surface of the wiring layer, and
the recess portion is filled with the insulating layer.

2. The wiring board according to claim 1 , wherein the height of the upper surface of the wiring layer is lower than that of an upper surface of the insulating layer.

3. The wiring board according to claim 1 , wherein the wiring layer consists of an electrolytic metal plating layer, and the side surface and lower surface of the wiring layer are roughened.

4. The wiring board according to claim 1 , wherein
the wiring layer further comprises a pad configured to be connected to a terminal of an electronic component.

5. The wiring board according to claim 1 , wherein the recess portion is fully filled with the insulating layer.

6. The wiring board according to claim 1 , wherein the recess portion is formed in the whole of the outer edge portion of the upper surface of the wiring layer.

7. The wiring board according to claim 1 , wherein a peripheral edge portion of the upper surface of the wiring layer is covered with the insulating layer.

8. The wiring board according to claim 1 , wherein an opening portion is formed in a lower surface of the insulating layer such that a portion of the lower surface of the wiring layer is exposed through the opening portion, and the exposed portion of the lower surface of the wiring layer is configured as an external connection pad.

9. An electronic component device comprising:
the wiring board according to claim 1 ; and
an electronic component having a terminal, wherein the terminal is connected to the upper surface of the wiring layer of the wiring board.

Assignees

• Shinko Electric Ind Co

Inventors

• Yanagisawa Hiroharu
• Kobayashi Kazuhiro

Classifications

• H05K1/0213

  Electrical arrangements not otherwise provided for · CPC title

• H05K2201/09772

  Conductors directly under a component but not electrically connected to the component · CPC title

• H05K2201/098

  Special shape of the cross-section of conductors, e.g. very thick plated conductors · CPC title

• H05K2203/1105

  Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating · CPC title

• H05K2201/09472

  Recessed pad for surface mounting; Recessed electrode of component · CPC title