Conductive film, conductive film manufacturing method, and touch panel

Patent metadata

Field	Value
Publication number	US-10108304-B2
Application number	US-201615234845-A
Country	US
Kind code	B2
Filing date	Aug 11, 2016
Priority date	Mar 28, 2014
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

An object of the invention is to provide a conductive film that can prevent an operation error caused by ion migration and is suitable for, for example, a projected capacitive touch panel, a method for manufacturing the conductive film, and a touch panel using the conductive film. In the conductive film, a resin layer is laminated on a surface of a substrate. A mesh-shaped groove portion is formed in a surface of the resin layer. A thin metal wire is provided in the groove portion to form an electrode pattern. When a value indicating ion migration characteristics of the electrode pattern in a longitudinal direction is ML and a value indicating ion migration characteristics of the electrode pattern in a lateral direction is MS, a migration ratio obtained by dividing the larger of the two values ML and MS by the smaller value is in the range of 1.0 to 1.4.

First claim

What is claimed is:

1. A conductive film comprising:
a substrate;
a resin layer that is laminated on the substrate and has a bank portion and a mesh-shaped groove portion formed in a surface on the resin layer; and
a thin metal wire that is provided in the groove portion of the resin layer,
wherein the thin metal wire forms an electrode pattern, and
wherein a value indicating ion migration characteristics of the electrode pattern in a longitudinal direction is ML, a value indicating ion migration characteristics of the electrode pattern in a lateral direction is MS, and a migration ratio obtained by dividing the larger of the two values ML and MS by the smaller value is in the range of 1.0 to 1.4.

2. The conductive film according to claim 1 ,
wherein the value ML is less than the value MS.

3. The conductive film according to claim 1 ,
wherein the migration ratio is in the range of 1.0 to 1.2.

4. The conductive film according to claim 2 ,
wherein the migration ratio is in the range of 1.0 to 1.2.

5. The conductive film according to claim 1 ,
wherein the resin layer comprises a metal capture material.

6. The conductive film according to claim 2 ,
wherein the resin layer comprises a metal capture material.

7. The conductive film according to claim 3 ,
wherein the resin layer comprises a metal capture material.

8. The conductive film according to claim 4 ,
wherein the resin layer comprises a metal capture material.

9. The conductive film according to claim 1 ,
wherein the thin metal wire comprises the metal capture material.

10. The conductive film according to claim 5 ,
wherein the metal capture material comprises at least one material selected from a group that consists of triazoles, imidazoles, tetrazoles, and triazaindolizines.

11. A conductive film manufacturing method of the conductive film according to claim 1 , comprising:
a resin layer laminating step of laminating the resin layer on the substrate;
a resin layer surface forming step of forming the bank portion and the mesh-shaped groove portion in the surface of the resin layer;
an ink filling step of supplying ink including metal particles to the surface of the resin layer and sliding an ink application member on the surface of the resin layer to fill the groove portion with the ink; and
an ink removal step of sliding an ink removal member on the surface of the resin layer to remove the ink remaining on the bank portion,
wherein a direction in which the ink application member slides in the ink filling step is different from a direction in which the ink removal member slides in the ink removal step.

12. The conductive film manufacturing method according to claim 11 ,
wherein the direction in which the ink application member slides in the ink filling step is perpendicular to the direction in which the ink removal member slides in the ink removal step.

13. The conductive film manufacturing method according to claim 11 ,
wherein the direction in which the ink application member slides in the ink filling step is parallel to a longitudinal direction of an electrode pattern.

14. A conductive film manufacturing method of the conductive film according to claim 1 , comprising:
a resin layer laminating step of laminating the resin layer on the substrate;
a resin layer surface forming step of forming the bank portion and the mesh-shaped groove portion in the surface of the resin layer;
an ink filling step of supplying ink including metal particles to the surface of the resin layer and sliding an ink application member on the surface of the resin layer to fill the groove portion with the ink;
an ink removal step of sliding an ink removal member on the surface of the resin layer to remove the ink remaining on the bank portion; and
a metal capture material addition step of adding a metal capture material.

15. The conductive film manufacturing method according to claim 14 ,
wherein the metal capture material addition step has a step of adding the metal capture material to the resin layer as a part of the resin layer laminating step.

16. The conductive film manufacturing method according to claim 14 ,
wherein the metal capture material addition step is performed after the groove portion forming step, and
in the metal capture material addition step, the surface of the resin layer is treated by a treatment liquid comprising the metal capture material.

17. The conductive film manufacturing method according to claim 14 ,
wherein the metal capture material addition step is a part of the ink removal step, and
in the metal capture material addition step, the ink removal member that is impregnated with a treatment liquid comprising the metal capture material is used.

18. The conductive film manufacturing method according to claim 14 ,
wherein the metal capture material addition step is a part of the ink filling step, and
in the metal capture material addition step, the metal capture material is added to the ink.

19. The conductive film manufacturing method according to claim 15 ,
wherein the metal capture material comprises at least one material selected from a group that consists of triazoles, imidazoles, tetrazoles, and triazaindolizines.

20. A touch panel comprising:
the conductive film according to claim 1 .

Assignees

• Fujifilm Corp

Inventors

• Satou Tasuku

Classifications

• H05K3/04

  the conductive material being removed mechanically, e.g. by punching · CPC title

• G06F3/044 Primary

  by capacitive means · CPC title

• H05K2201/09045

  Locally raised area or protrusion of insulating substrate · CPC title

• H05K2203/0139

  Blade or squeegee, e.g. for screen printing or filling of holes · CPC title

• H05K3/1258 Primary

  by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern · CPC title