Heat radiation adhesive, heat radiation sheet using same, and electronic device having same
US-10130002-B2 · Nov 13, 2018 · US
Thermal details
Thermal details · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2201/06 |
| Official title | Thermal details |
| Display label | Thermal details |
| Total patents | 151 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 14 |
| 2017 | 30 |
| 2018 | 16 |
| 2019 | 14 |
| 2020 | 11 |
| 2021 | 7 |
| 2022 | 13 |
| 2023 | 17 |
| 2024 | 9 |
| 2025 | 10 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
System and method for thermal management of electronic devices
US-10123460-B2 · Nov 6, 2018 · US
Circuit board structures for thermal insulation and method of making same
US-2018302984-A1 · Oct 18, 2018 · US
Semiconductor device wiring pattern and connections
US-10070528-B2 · Sep 4, 2018 · US
Printed circuit board, module using printed circuit board, and camera module using printed circuit board
US-2018213642-A1 · Jul 26, 2018 · US
Electronic power module with enhanced thermal dissipation and manufacturing method thereof
US-9986631-B2 · May 29, 2018 · US
Component vertical mounting
US-2018116048-A1 · Apr 26, 2018 · US
Method for producing an electronic component, and electronic assembly, a heating device being provided in the substrate of the assembly
US-9888559-B2 · Feb 6, 2018 · US
Circuit substrate and semiconductor device
US-2018005918-A1 · Jan 4, 2018 · US
Circuit arrangement for vehicles and use of a circuit arrangement
US-9860986-B2 · Jan 2, 2018 · US
Heat dissipating structure
US-9826623-B2 · Nov 21, 2017 · US
Graphene Based Conformal Heat Sink and Method Therefor
US-2017315596-A1 · Nov 2, 2017 · US
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
US-2017291397-A1 · Oct 12, 2017 · US
Light emitting package having a guiding member guiding an optical member
US-2017271569-A1 · Sep 21, 2017 · US
Printed wiring board
US-2017245369-A1 · Aug 24, 2017 · US
Method of manufacturing electronic unit
US-2017245373-A1 · Aug 24, 2017 · US
Alloy bonded graphene sheets for enhanced thermal spreaders
US-9736923-B1 · Aug 15, 2017 · US
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
US-9724896-B2 · Aug 8, 2017 · US
Server system
US-2017202111-A1 · Jul 13, 2017 · US
Light emitting package having a guiding member guiding an optical member
US-9705059-B2 · Jul 11, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2201/06?
- CPC H05K2201/06 is the Cooperative Patent Classification code for “Thermal details.”
- How many patents are filed under CPC H05K2201/06 (Thermal details)?
- Our database includes 151 publications tagged with this CPC code.
- Is patent activity under CPC H05K2201/06 growing?
- Publication counts under this code: 9 in 2024 vs 10 in 2025 (latest complete years).