Heat dissipating structure

Patent metadata

Field	Value
Publication number	US-9826623-B2
Application number	US-201314893255-A
Country	US
Kind code	B2
Filing date	Dec 12, 2013
Priority date	May 22, 2013
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

First claim

The invention claimed is:

1. A heat dissipation structure, comprising:
(A) a printed circuit board;
(B) a first heat-generating element;
(C) a second heat-generating element; and
(D) a cured product of a thermally conductive curable liquid resin composition,
the printed circuit board (A) having a first surface and a second surface that is opposite to the first surface,
the first heat-generating element (B) being placed on the first surface, the second heat-generating element (C) being placed on the second surface,
the first heat-generating element (B) generating an equal or greater amount of heat than the second heat-generating element (C),
the second heat-generating element (C) being surrounded by the cured product (D),
the first heat-generating element (B) being surrounded by a layer that has a lower thermal conductivity than the cured product (D); and
wherein, as seen in a perspective view in a direction perpendicular to the first surface of the printed circuit board (A), at least a part of a region where the first heat-generation element (B) is placed overlaps at least a part of a region where the second heat-generating element (C) and the cured product (D) are placed.

2. The heat dissipation structure according to claim 1 ,
wherein the thermally conductive curable liquid resin composition is curable by moisture or heat.

3. The heat dissipation structure according to claim 1 ,
wherein the thermally conductive curable liquid resin composition comprises (I) a curable acrylic resin or a curable polypropylene oxide resin and (II) a thermally conductive filler, and has a viscosity of at least 30 Pa·s but not more than 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or higher.

4. A heat dissipation structure, comprising:
(A) a printed circuit board;
(B) a first heat-generating element;
(C) a second heat-generating element;
(D) a cured product of a thermally conductive curable liquid resin composition; and
(E) an eletromagnetic shielding case
the printed circuit board (A) having a first surface and a second surface that is opposite to the first surface,
the first heat-generating element (B) being placed on the first surface, the second heat-generating element (C) being placed on the second surface,
the first heat-generating element (B) generating an equal or greater amount of heat than the second heat-generating element (C),
the second heat-generating element (C) being surrounded by the cured product (D),
the first heat-generating element (B) being surrounded by a layer that has a lower thermal conductivity than the cured product (D);
wherein the electromagnetic shielding case (E) is mounted on the second surface, and the cured product (D) is placed inside the electromagnetic shielding case (E) mounted on the second surface.

5. The heat dissipation structure according to claim 4 ,
wherein the thermally conductive curable liquid resin composition is curable by moisture or heat.

6. The heat dissipation structure according to claim 4 ,
wherein the thermally conductive curable liquid resin composition comprises (I) a curable acrylic resin or a curable polypropylene oxide resin and (II) a thermally conductive filler, and has a viscosity of at least 30 Pa·s but not more than 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or higher.

7. A heat dissipation structure, comprising:
(A) a printed circuit board,
(B) a first heat-generating element;
(C) a second heat-generating element;
(D) a cured product of a thermally conductive curable liquid resin composition; and
(E) an electromagnetic shielding case
the printed circuit board (A) having a first surface and a second that is opposite to the first surface,
the first heat-generating element (B) being placed on the first surface, the second heat-generating element (C) being placed on the second surface,
the first heat-generating element (B) generating an equal or greater amount of heat than the second heat-generating element (C),
the second heat-generating element (C) being surrounded by the cured product (D),
the first heat-generating element (B) being surrounded by a layer that has a lower thermal conductivity than the cured product (D);
wherein, as seen in a perspective view in a direction perpendicular to the first surface of the printed circuit board (A), at least a part of a region where the first heat-generating element (B) is placed overlaps at least a part of a region where the second heat-generating element (C) and the cured product (D) are placed.

8. The heat dissipation structure according to claim 7 ,
wherein the thermally conductive curable liquid resin composition is curable by moisture or heat.

9. The heat dissipation structure according to claim 7 ,
wherein the thermally conductive curable liquid resin composition comprises (I) a curable acrylic resin or a curable polypropylene oxide resin and (II) a thermally conductive filler, and has a viscosity of at least 30 Pa·s but not more than 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or higher.

Assignees

• Kaneka Corp

Inventors

• KOUKAMI Aki
• Hagiwara Kazuo
• OGUMA Keisuke
• Fujimoto Kazuhide

Classifications

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/473

  containing a filler · CPC title

• H10W40/251

  Organics · CPC title

• H05K2203/1327

  Moulding over PCB locally or completely · CPC title

• H05K2201/10371

  Shields or metal cases · CPC title