Circuit board structures for thermal insulation and method of making same

Patent metadata

Field	Value
Publication number	US-2018302984-A1
Application number	US-201715486174-A
Country	US
Kind code	A1
Filing date	Apr 12, 2017
Priority date	Apr 12, 2017
Publication date	Oct 18, 2018
Grant date	—

Abstract

Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

First claim

1 . A circuit board comprising:
a metal core including:
a first metal portion comprising at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first height along a first line of direction; and
a second metal portion comprising at least five percent of the metal core by volume, wherein a second surface of the second portion is at a second height along the first line of direction, wherein a difference between the first height and the second height is less than, and at least twenty percent of, an overall thickness of the metal core; and
an insulator material disposed on the metal core.

2 . The circuit board of claim 1 , wherein a first periphery of the first portion has a first average thickness along the first line of direction, wherein a second periphery of the second portion has a second average thickness along the first line of direction, wherein the first average thickness is at least two times the second average thickness.

3 . The circuit board of claim 2 , wherein, for any point along the first periphery, a thickness of the first portion through the point is within ten percent of the first average thickness.

4 . The circuit board of claim 1 , wherein an average thickness of all of the first portion is at least two times an average thickness of all of the second portion.

5 . The circuit board of claim 1 , the metal core further comprising a trench portion disposed between the first portion and the second portion.

6 . The circuit board of claim 1 , wherein the first portion forms a first recess.

7 . The circuit board of claim 6 , wherein the second portion forms a second recess.

8 . The circuit board of claim 7 , wherein the first recess is formed in a first side of the metal core, wherein the second recess is formed in a second side of the metal core, the second side opposite the first side.

9 . The circuit board of claim 1 , wherein the first portion and the second portion each comprise at least twenty percent of the metal core by volume.

10 . A method comprising:
fabricating a circuit board, including:
forming a first portion of the metal core, wherein a first surface of the first portion is at a first height along a first line of direction; and
forming a second portion of the metal core, wherein the first portion and the second portion each comprise at least five percent of the metal core by volume, wherein a second surface of the second portion is at a second height along the first line of direction, wherein a difference between the first height and the second height is less than, and at least twenty percent of, an overall height of the metal core; and
depositing an insulator material on the metal core.

11 . The method of claim 10 , wherein a first periphery of the first portion has a first average thickness along the first line of direction, wherein a second periphery of the second portion has a second average thickness along the first line of direction, wherein the first average thickness is at least two times the second average thickness.

12 . The method of claim 10 , further comprising forming a trench portion between the first portion and the second portion.

13 . The method of claim 10 , wherein forming the first portion comprises forming a first recess of the first portion.

14 . The method of claim 13 , wherein forming the second portion comprises forming a second recess of the second portion.

15 . The method of claim 14 , wherein the first recess is formed in a first side of the metal core, wherein the second recess is formed in a second side of the metal core, the second side opposite the first side.

16 . The method of claim 10 , further comprising coupling first circuitry to the circuit board.

17 . The method of claim 16 , further comprising exchanging a voltage or a signal with the first circuitry.

18 . A system comprising:
a circuit board including:
a metal core comprising:
a first portion comprising at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first height along a first line of direction; and
a second portion comprising at least five percent of the metal core by volume, wherein a second surface of the second portion is at a second height along the first line of direction, wherein a difference between the first height and the second height is less than, and at least twenty percent of, an overall thickness of the metal core; and

an insulator material disposed on the metal core;
integrated circuitry coupled to the circuit board, the integrated circuitry to communicate a signal via the circuit board; and a display device coupled to the integrated circuitry, the display device to display an image based on the signal.

19 . The system of claim 18 , wherein a first periphery of the first portion has a first average thickness along the first line of direction, wherein a second periphery of the second portion has a second average thickness along the first line of direction, wherein the first average thickness is at least two times the second average thickness.

20 . The system of claim 18 , the metal core further comprising a trench portion disposed between the first portion and the second portion.

21 . The system of claim 18 , wherein the first portion forms a first recess.

Assignees

• Intel Corp

Inventors

• Sundaram Arvind

Classifications

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• H05K1/05 Primary

  Insulated {conductive substrates, e.g. insulated} metal substrate · CPC title

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title

• H05K3/44 Primary

  Manufacturing insulated metal core circuits {or other insulated electrically conductive core circuits (H05K3/0058, H05K3/4608, and H05K3/4641 take precedence)} · CPC title

• G06F1/1626 Primary

  with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs] · CPC title