Method for producing an electronic component, and electronic assembly, a heating device being provided in the substrate of the assembly

Patent metadata

Field	Value
Publication number	US-9888559-B2
Application number	US-201515325550-A
Country	US
Kind code	B2
Filing date	Jun 17, 2015
Priority date	Jul 11, 2014
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

First claim

What is claimed is:

1. A method for producing an electronic assembly, the method comprising:
providing a substrate having a mounting surface that defines a mounting side for components,
embedding an electrical heating device into the substrate beneath the mounting surface,
mounting components on the mounting side of the substrate,
heating the substrate using the heating device to a temperature that assists a thermal mounting process,
wherein the heating device is electrically operated independently of circuits formed by the electronic assembly during the thermal mounting process, and
wherein the heating device is electrically connected to at least one circuit of the electronic assembly after the thermal mounting process, wherein the at least one circuit is configured to operate the heating device.

2. The method of claim 1 , wherein the mounting process includes soldering, adhesive bonding, or coating.

3. The method of claim 1 , comprising supplying the heating device with electrical energy using probe needles or terminals during the thermal mounting process.

4. The method of claim 1 , wherein the electrical heating device is connected to said electronic circuit via plug contacts or solder connections.

5. The method of claim 1 , wherein the electrical heating device is connected to said electronic circuit by contact pieces integrated into a housing component for the electronic assembly, wherein he contact pieces are electrically connected by mounting the housing component on the electronic assembly.

6. The method of claim 1 , wherein the electrical heating device is connected to said electronic circuit by a mechanical switch, a diode, a transistor, or a relay.

7. The method of claim 1 , comprising locally heating the substrate at different intensities during the thermal mounting process.

8. The method of claim 1 , wherein a temperature sensor electrically connected to said electronic circuit is provided on the substrate.

9. The method of claim 8 , wherein:
an external control apparatus makes contact with the temperature sensor during the thermal mounting process,
the control apparatus is provided by a mounting system in which the production method is performed, and
the control apparatus is configured to control the energy supply to the heating device.

10. The method of claim 9 , wherein:
during the thermal mounting process, the temperature sensor is electrically operated independently of the electronic circuits formed by the electronic assembly, and
he temperature sensor is electrically connected to at least one of the electronic circuits of the electronic assembly after the mounting process, wherein the at least one electronic circuit is configured to operate the heating device.

11. A method for disassembling at least one part of an electronic assembly, comprising:
h providing a substrate having a mounting surface that defines a mounting side for components,
embedding an electrical heating device into said substrate beneath the mounting surface,
mounting components on the mounting side of the substrate,
wherein the substrate is heated by the heating device to a temperature that assists thermal disassembly process,
during the thermal disassembly process, the heating device is electrically operated independently of electronic circuits formed by the electronic assembly,
removing at least one component from the substrate, and
electrically connecting the heating device to at least one of the electronic circuits of the electronic assembly after the disassembly process or after a component mounting process that follows the disassembly process, wherein the at least one electronic circuit is configured to operate the heating device.

12. An electronic assembly, comprising:
a substrate having a mounting surface that defines a mounting side for components,
an electrical heating device embedded in said substrate beneath the mounting surface,
components mounted on the mounting side of the substrate, wherein the components define at least one electronic circuit,
herein the heating device is electrically connected to at least one of the electronic circuits of the electronic assembly, wherein the at least one electronic circuit is configured to operate the heating device, and
a contact structure arranged between the heating device and said electronic circuit and accessible from outside the electronic assembly.

13. The electronic assembly of claim 12 , wherein the contact structure is connected to a switch.

14. The electronic assembly of claim 12 , wherein the heating device has a plurality of segments that individually actuatable.

15. The electronic assembly of claim 14 , wherein the segments in the substrate lie one beneath the other with respect to the mounting side of the substrate.

Assignees

• Siemens Ag
• Neue Mat Bayreuth Gmbh

Inventors

• Knofe Ruediger
• Mueller Bernd
• Prihodovsky Andrey

Classifications

• H05K1/0212 Primary

  Printed circuits or mounted components having integral heating means · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title

• H05K2201/10166

  Transistor · CPC title

• H05K1/167

  incorporating printed resistors · CPC title

• H05K3/3494

  Heating processes for reflow soldering · CPC title