Printed circuit board module and electronic device
US-2024260184-A1 · Aug 1, 2024 · US
Materials
Materials · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2201/032 |
| Official title | Materials |
| Display label | Materials |
| Total patents | 182 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 30 |
| 2016 | 16 |
| 2017 | 34 |
| 2018 | 18 |
| 2019 | 12 |
| 2020 | 6 |
| 2021 | 8 |
| 2022 | 8 |
| 2023 | 12 |
| 2024 | 17 |
| 2025 | 13 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flexible interconnect
US-2017367179-A1 · Dec 21, 2017 · US
Rosin-free thermosetting flux formulations
US-9802275-B2 · Oct 31, 2017 · US
Laminate For Printed Wiring Board, Method Of Manufacturing Printed Wiring Board, And Method Of Manufacturing Electronic Device
US-2017231101-A1 · Aug 10, 2017 · US
Method of forming a metal layer and method of manufacturing a substrate having such metal layer
US-2017130354-A1 · May 11, 2017 · US
Printable Films for Printed Circuit Boards and Processes for Making Same
US-2017135220-A1 · May 11, 2017 · US
Adhesive body comprising conductive polymer-metal complex and substrate and method for forming the same, conductive polymer-metal complex dispersion liquid, method for manufacturing the same and method for applying the same, and method for filling hole using conductive material
US-9622346-B2 · Apr 11, 2017 · US
Articles with conductive micro-wire pattern
US-9591752-B2 · Mar 7, 2017 · US
Conductive paste
US-9574091-B2 · Feb 21, 2017 · US
Wiring substrate and method of manufacturing wiring substrate
US-9572252-B2 · Feb 14, 2017 · US
Resin multilayer substrate and method of manufacturing the same
US-2017034911-A1 · Feb 2, 2017 · US
Electrical barrier layers
US-9560773-B2 · Jan 31, 2017 · US
Printed circuit board and corresponding method for producing a printed circuit board
US-2017027066-A1 · Jan 26, 2017 · US
Printed circuit board and corresponding method for producing a printed circuit board
US-2017013715-A1 · Jan 12, 2017 · US
Ink composition and circuit board and method for producing the same
US-9502151-B2 · Nov 22, 2016 · US
Transparent electrode sheet, method for manufacturing transparent electrode sheet, and capacitive touch panel using such transparent electrode sheet
US-9485856-B2 · Nov 1, 2016 · US
Display device
US-9472772-B2 · Oct 18, 2016 · US
Electronic device
US-2016219696-A1 · Jul 28, 2016 · US
Electronic circuit assembly substrate and device thereof
US-2016165729-A1 · Jun 9, 2016 · US
Package-level electromagnetic interference shielding structures for a substrate
US-2016113108-A1 · Apr 21, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2201/032?
- CPC H05K2201/032 is the Cooperative Patent Classification code for “Materials.”
- How many patents are filed under CPC H05K2201/032 (Materials)?
- Our database includes 182 publications tagged with this CPC code.
- Is patent activity under CPC H05K2201/032 growing?
- Publication counts under this code: 17 in 2024 vs 13 in 2025 (latest complete years).