Conductive paste

Patent metadata

Field	Value
Publication number	US-9574091-B2
Application number	US-201314436565-A
Country	US
Kind code	B2
Filing date	Oct 18, 2013
Priority date	Oct 19, 2012
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

A conductive paste including: (A) a silver powder; (B) a glass frit; (C) an organic binder; and (D) a powder containing copper, tin, and manganese.

First claim

The invention claimed is:

1. A conductive paste comprising:
(A) a silver powder;
(B) a glass frit;
(C) an organic binder; and
(D) a powder containing copper, tin, and manganese,
wherein a mass ratio of tin to copper is 0.01 to 0.3:1, and a mass ratio of manganese to copper is 0.01 to 2.5:1 and the powder (D) is contained in an amount of 0.1 to 5.0 parts by mass based on 100 parts by mass of the silver powder (A).

2. The conductive paste according to claim 1 , wherein the powder (D) is a mixed powder of metals including copper, tin, and manganese.

3. The conductive paste according to claim 1 , wherein the powder (D) is a powder of an alloy containing copper, tin, and manganese.

4. The conductive paste according to claim 1 , wherein the powder (D) is a powder of a compound containing copper, tin, and manganese.

5. The conductive paste according to claim 1 , wherein the powder (D) contains an oxide or a hydroxide of one or more of copper, tin, and manganese.

6. The conductive paste according to claim 1 , wherein the silver powder (A) has an average particle diameter from 0.1 μm to 100 μm.

7. The conductive paste according to claim 1 , further comprising cobalt oxide (E).

8. The conductive paste according to claim 1 , further comprising bismuth oxide (F).

9. The conductive paste according to claim 1 , wherein the paste has a viscosity from 50 to 700 Pa·s.

10. A printed circuit board obtained by, after applying the conductive paste according to claim 1 on a substrate, firing the substrate at a temperature of 500° C. to 900° C.

11. An electronic device obtained by soldering an electronic part on the printed circuit board according to claim 10 .

Assignees

• Namics Corp

Inventors

• Yoshii Yoshiaki

Classifications

• H05K2203/1126

  Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• C09D5/24 Primary

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• C09D201/00

  Coating compositions based on unspecified macromolecular compounds · CPC title

• H01B1/16 Primary

  the conductive material comprising metals or alloys · CPC title