Electrical barrier layers

Patent metadata

Field	Value
Publication number	US-9560773-B2
Application number	US-201514809117-A
Country	US
Kind code	B2
Filing date	Jul 24, 2015
Priority date	Jul 15, 2011
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

An electrical connection structure includes a variable-composition nickel alloy layer with a minor constituent selected from a group consisting of boron, carbon, phosphorus, and tungsten, wherein at least over a portion of a conductive substrate, the concentration of the minor constituent decreases throughout the variable-composition nickel alloy layer in a direction from the bottom surface of the variable-composition nickel alloy layer to the top surface of the variable-composition nickel alloy layer.

First claim

The invention claimed is:

1. A device comprising an electrical connection structure comprising:
a conductive substrate;
a variable-composition nickel alloy layer above the conductive substrate and in electrical contact with the conductive substrate, the variable-composition nickel alloy layer having a bottom surface overlying and physically contacting a first surface of a first material, and having a top surface underlying and physically contacting a second surface of a second material, wherein the first and second materials do not have nickel as a major constituent, the variable-composition nickel alloy layer comprising a minor constituent selected from a group consisting of boron, carbon, phosphorus, and tungsten, wherein at least over a portion of the conductive substrate, the concentration of the minor constituent decreases throughout the variable-composition nickel alloy layer in a direction from the bottom surface of the variable-composition nickel alloy layer to the top surface of the variable-composition nickel alloy layer; and
a conductive layer disposed above the variable-composition nickel alloy layer and in electrical contact with the variable-composition nickel alloy layer and the conductive substrate.

2. A device comprising an electrical connection structure comprising:
a conductive substrate whose top surface does not include nickel as a major constituent;
a variable-composition nickel alloy layer on the conductive substrate, the variable-composition nickel alloy layer comprising a minor constituent selected from a group consisting of boron, carbon, phosphorus, and tungsten, wherein at least over a portion of the conductive substrate, the concentration of the minor constituent decreases throughout the variable-composition nickel alloy layer in a direction from the bottom surface of the variable-composition nickel alloy layer to the top surface of the variable-composition nickel alloy layer; and
a conductive layer on the variable-composition nickel alloy layer, the conductive layer having a bottom surface which does not include nickel as a major constituent.

Assignees

• Tessera Inc

Inventors

• Uzoh Cyprian
• Oganesian Vage
• Mohammed Ilyas
• Haba Belgacem
• Savalia Piyush
• Mitchell Craig

Classifications

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H01L2924/01074

  Electricity · mapped topic