The invention claimed is:
1. An adhesive body comprising a conductive polymer-metal complex and a plastic substrate, wherein
the conductive polymer-metal complex comprises an organic conductive polymer and metal nanoparticles having a diameter of 5 nm or more and less than 100 nm,
wherein at least a part of the metal nanoparticles is exposed on a surface of the organic conductive polymer;
wherein the complex is adhered to a surface of the plastic substrate comprising narrow holes having a size of 5 nm or more; and
the complex comprises microparticles having a diameter of 5 nm to 500 nm in the narrow holes on the surface of the plastic substrate adhering the complex to the surface of the plastic substrate.
2. The adhesive body comprising the conductive polymer-metal complex and the plastic substrate according to claim 1 , wherein the narrow holes have a size of 5 nm or more and 1000 nm or less.
3. The adhesive body comprising the conductive polymer-metal complex and the plastic substrate according to claim 1 , wherein the microparticles are bound to each other.
4. The adhesive body comprising the conductive polymer-metal complex and the plastic substrate according to claim 3 , wherein the binding of the microparticles of the complex to each other occurs via Van der Waals' force or a hydrogen bond.
5. The adhesive body comprising the conductive polymer-metal complex and the plastic substrate according to claim 1 , wherein the organic conductive polymer is an organic polymer of a straight chain, aromatic, heterocyclic compound or a heteroatom compound having a conjugation structure.
6. The adhesive body comprising the conductive polymer-metal complex and the plastic substrate according to claim 1 , wherein the organic conductive polymer is a polymer of a monomer selected from the group consisting of pyrrole, 3,4-ethylenedioxythiophene and aniline.
7. The adhesive body comprising the conductive polymer-metal complex and the plastic substrate according to claim 1 , wherein the metal is at least one metal selected from the group consisting of gold, platinum, palladium, ruthenium, iridium, silver, copper, nickel, iron, chromium, zinc, cadmium, tellurium, tin and lead.
8. A method for forming the adhesive body comprising the conductive polymer-metal complex and the plastic substrate according to claim 1 , said method comprising adhering a conductive polymer-metal complex dispersion liquid wherein microparticles of a conductive polymer-metal complex comprising an organic conductive polymer and metal nanoparticles with at least a part of the metal nanoparticles being exposed on a surface of the organic conductive polymer is dispersed in a solvent to a substrate.
9. The adhesive body comprising the conductive polymer-metal complex and the plastic substrate according to claim 1 , wherein the plastic is selected from the group consisting of an acrylonitrile butadiene styrene (ABS) copolymer, an olefin resin, polypropylene, polyimide, polytetrafluoroethylene, polyvinyl chloride and polyethylene terephthalate.