comprising means for eliminating an insulative layer prior to soldering or welding

comprising means for eliminating an insulative layer prior to soldering or welding · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01R4/026
Official title{comprising means for eliminating an insulative layer prior to soldering or welding}
Display labelcomprising means for eliminating an insulative layer prior to soldering or welding
Total patents25

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
20151
20161
20171
20181
20192
20204
20212
20223
20235
20243
20251
20261

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01R4/026?
CPC H01R4/026 is the Cooperative Patent Classification code for “comprising means for eliminating an insulative layer prior to soldering or welding.”
How many patents are filed under CPC H01R4/026 (comprising means for eliminating an insulative layer prior to soldering or welding)?
Our database includes 25 publications tagged with this CPC code.
Is patent activity under CPC H01R4/026 growing?
Publication counts under this code: 3 in 2024 vs 1 in 2025 (latest complete years).