Conductor wire connection method, half-stripping jig, connection device, and electronic device
US-2026066600-A1 · Mar 5, 2026 · US
comprising means for eliminating an insulative layer prior to soldering or welding · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01R4/026 |
| Official title | {comprising means for eliminating an insulative layer prior to soldering or welding} |
| Display label | comprising means for eliminating an insulative layer prior to soldering or welding |
| Total patents | 25 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 1 |
| 2018 | 1 |
| 2019 | 2 |
| 2020 | 4 |
| 2021 | 2 |
| 2022 | 3 |
| 2023 | 5 |
| 2024 | 3 |
| 2025 | 1 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2026066600-A1 · Mar 5, 2026 · US
US-12220573-B2 · Feb 11, 2025 · US
US-12021343-B2 · Jun 25, 2024 · US
US-11990698-B2 · May 21, 2024 · US
US-2024145942-A1 · May 2, 2024 · US
US-2023369788-A1 · Nov 16, 2023 · US
US-2023291137-A1 · Sep 14, 2023 · US
US-2023216260-A1 · Jul 6, 2023 · US
US-11600933-B2 · Mar 7, 2023 · US
US-11545800-B2 · Jan 3, 2023 · US
US-11426575-B2 · Aug 30, 2022 · US
US-2022134088-A1 · May 5, 2022 · US
US-11217921-B2 · Jan 4, 2022 · US
US-2021367364-A1 · Nov 25, 2021 · US
US-2021328398-A1 · Oct 21, 2021 · US
US-10721822-B2 · Jul 21, 2020 · US
US-10717153-B2 · Jul 21, 2020 · US
US-2020161778-A1 · May 21, 2020 · US
US-2020009370-A1 · Jan 9, 2020 · US
US-10314175-B2 · Jun 4, 2019 · US
Answers are generated from the same data shown on this page.