Electric connection structure and electric connection member

Patent metadata

Field	Value
Publication number	US-10314175-B2
Application number	US-201715613752-A
Country	US
Kind code	B2
Filing date	Jun 5, 2017
Priority date	Feb 26, 2015
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

First claim

What is claimed is:

1. An electric connection member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer,
the conductive interconnect is disposed in the recess,
a metal nano-ink is disposed on the conductive interconnect, and
all of the metal nano-ink is contained inside the recess, and
wherein the metal nano-ink is an encapsulated metal nano-ink that has a plurality of metal nanoparticles covered by a protective agent in a capsule and that forms a conductive thin film upon breaking of the capsule by means of external stimulus.

2. The electric connection member according to claim 1 , wherein the conductive thin film is formed by breaking the capsule and performing heat treatment at a temperature of less than 200° C.

3. The electric connection member according to claim 2 , wherein the protective agent is an amphiphilic molecule, the plurality of metal nanoparticles are dispersed in a hydrophobic organic solvent, and the capsule is composed of a hydrophilic compound derivative.

4. The electric connection member according to claim 2 , wherein the substrate is a flexible substrate.

5. A mounting structure of an electronic component assembly in which an electronic component having an electrode is mounted on the electric connection member according to claim 2 ,
wherein the conductive interconnect and the electrode are joined to each other by sintering the metal nano-ink in the recess of the insulating adhesive layer, and a surface of the insulating adhesive layer adheres to a surface of the electronic component.

6. An intermediate member used for producing the electric connection member according to claim 2 , the intermediate member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
wherein the intermediate member is provided with a recess that opens at a side of the insulating adhesive layer, and
the conductive interconnect is disposed in the recess.

7. The electric connection member according to claim 1 , wherein the protective agent is an amphiphilic molecule, the plurality of metal nanoparticles are dispersed in a hydrophobic organic solvent, and the capsule is composed of a hydrophilic compound derivative.

8. The electric connection member according to claim 7 , wherein the hydrophobic organic solvent has an n-octanol/water partition coefficient of not less than 2.

9. The electric connection member according to claim 7 , wherein the hydrophilic compound derivative has a contact angle of not more than 90° with respect to water.

10. The electric connection member according to claim 7 , wherein the amphiphilic molecule has a hydrophile-lipophile balance value of 0to 13.

11. The electric connection member according to claim 7 , wherein the substrate is a flexible substrate.

12. A mounting structure of an electronic component assembly in which an electronic component having an electrode is mounted on the electric connection member according to claim 7 ,
wherein the conductive interconnect and the electrode are joined to each other by sintering the metal nano-ink in the recess of the insulating adhesive layer, and a surface of the insulating adhesive layer adheres to a surface of the electronic component.

13. An intermediate member used for producing the electric connection member according to claim 7 , the intermediate member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
wherein the intermediate member is provided with a recess that opens at a side of the insulating adhesive layer, and
the conductive interconnect is disposed in the recess.

14. The electric connection member according to claim 2 , wherein the substrate is a flexible substrate.

15. A mounting structure of an electronic component assembly in which an electronic component having an electrode is mounted on the electric connection member according to claim 1 ,
wherein the conductive interconnect and the electrode are joined to each other by sintering the metal nano-ink in the recess of the insulating adhesive layer, and a surface of the insulating adhesive layer adheres to a surface of the electronic component.

16. An intermediate member used for producing the electric connection member according to claim 1 , the intermediate member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
wherein the intermediate member is provided with a recess that opens at a side of the insulating adhesive layer, and
the conductive interconnect is disposed in the recess.

Assignees

• Japan Aviation Electronics Ind Ltd

Inventors

• Sato Junya
• Mitsui Ryosuke

Classifications

• H01R12/52

  connecting to other rigid printed circuits or like structures · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H01R4/026

  comprising means for eliminating an insulative layer prior to soldering or welding · CPC title

• H05K2201/10659

  Different types of terminals for the same component, e.g. solder balls combined with leads · CPC title

• C09D11/38

  characterised by non-macromolecular additives other than solvents, pigments or dyes · CPC title