Connection method for connecting an isolated micro-conductor
US-2020009370-A1 · Jan 9, 2020 · US
US11426575B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11426575-B2 |
| Application number | US-201916460917-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 2, 2019 |
| Priority date | Jul 6, 2018 |
| Publication date | Aug 30, 2022 |
| Grant date | Aug 30, 2022 |
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Official abstract text for this publication.
The present invention relates to a method for connecting a strand of a multi-strand cable to an electrode of an implantable medical device. The method includes cutting a strand of the multi-strand cable lifting at least one of the free ends, stripping the end of the lifted strand, placing an electrode around the multi-strand cable to partially cover the end of the lifted and stripped stand, and connecting at least one portion of the stripped end of the strand to the electrode.
Opening claim text (preview).
What is claimed is: 1. A method for connecting a strand of a multi-strand cable to an electrode of an implantable medical device, comprising the steps of: cutting the strand of the multi-strand cable to form two free ends at the cut of the strand; lifting at least one of the free ends relative to the rest of the multi-strand cable; at least partially stripping the end of the lifted strand; placing the electrode around the multi-strand cable so as to partially cover the end of the lifted and stripped strand; connecting at least one portion of the stripped end of the strand to the electrode. 2. The method according to claim 1 , the method further comprising: covering the other of the free ends of the strand by introducing an insulating sleeve-around the multi-strand cable. 3. The method according to claim 2 , the method further comprising: laying at least one of a second sleeve or a polymer glue around the multi-strand cable to control the length of the end of the lifted strand relative to the rest of the multi-strand cable. 4. The method according to claim 1 , wherein the cutting comprises at least one of a laser cut, a laser ablation, or the use of a mechanical cutting device. 5. A method for connecting a strand of a multi-strand cable to an electrode of an implantable medical device, comprising the steps of: cutting the strand of the multi-strand cable to form two free ends at the cut of the strand; lifting at least one of the free ends relative to the rest of the multi-strand cable; placing a metal hypotube around the end of the lifted strand so that the metal hypotube is electrically connected to the end of the strand; placing the electrode around the multi-strand cable so as to partially cover the metal hypotube; connecting at least a portion of the metal hypotube to the electrode. 6. The method according to claim 5 , wherein the connection is performed by laser welding, crimping or electric welding. 7. The method according to claim 5 , further comprising: laying a polymer sheath in order to coat the multi-strand cable and the electrode welded to the multi-strand cable. 8. The method according to claim 5 , wherein the electrode is a ring-shaped electrode such that the ring comprises a central hole or a slot configured to perform the welding in step. 9. The method according to claim 5 , wherein the electrode is a ring-shaped electrode such that the ring comprises an internal cavity adapted to the dimension of the end of the lifted strand. 10. The method according claim 5 , such that the diameter of the strand is between 10 μm and 200 μm, and the diameter of the multi-strand microcable, that is to say the diameter of the entire multi-strand microcable, is less than 0.66 mm and is made from biocompatible materials.
for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence) · CPC title
for cylindrical elongated bodies, e.g. cables having circular cross-section (H01R4/01 takes precedence) · CPC title
using a crimping sleeve {(H01R4/01 takes precedence)} · CPC title
Laser welding (H01R43/0228 takes precedence) · CPC title
Transvascular endocardial electrode systems · CPC title
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